Datasheet

MAX3735/MAX3735A
2.7Gbps, Low-Power SFP Laser Drivers
16 ______________________________________________________________________________________
Bonding Coordinates
*Index pad. Orient the die with this pad in the lower-left corner.
**Bond out both pairs of OUT- and OUT+ to minimize series
inductance.
Chip Information
TRANSISTOR COUNT: 327
SUBSTRATE CONNECTED TO GND
DIE SIZE: 60 mils x 79 mils
PROCESS: SiGe Bipolar
Table 5. MAX3735 Bondpad Locations
COORDINATES
PAD NAME
XY
1* BC_MON 47 47
2 PC_MON 47 229
3V
CC
47 514
4 IN- 47 696
5 IN+ 47 878
6V
CC
47 1063
7 GND 242 1149
8 TX_DISABLE 452 1149
9 APCSET 636 1149
10 GND 819 1149
11 APCFILT2 1008 1149
12 APCFILT1 1193 1149
13 MD 1383 1149
14 GND 1567 1149
15 V
CC
1758 1032
16** OUT- 1758 888
17** OUT- 1758 742
18** OUT+ 1758 579
19** OUT+ 1758 433
20 V
CC
1758 289
21 BIAS 1758 93
22 GND 1578 -64
23 GND 1401 -64
24 MODSET 1205 -64
25 TX_FAULT 1016 -64
26 SHUTDOWN 818 -64
27 V
CC
623 -64
28 GND 435 -64
29 GND 245 -64
22
MAX3735
MAX3735A
2324
21 20 19
7
89
10 11 12
1
2
3
4
5
6
18
17
16
15
14
13
V
CC
Thin QFN*
(4mm x 4mm)
TOP VIEW
IN+
IN-
V
CC
PC_MON
BC_MON
V
CC
OUT-
OUT+
OUT+
V
CC
BIAS
GND
V
CC
SHUTDOWN
TX_FAULT
MODSET
GND
TX_DISABLE APCSET GND APCFILT2 APCFILT1 MD
*THE EXPOSED PAD MUST BE CONNECTED TO CIRCUIT BOARD GROUND FOR PROPER
THERMAL AND ELECTRICAL PERFORMANCE.
Pin Configuration