Datasheet

Detailed Description
The MAX3394E/MAX3395E/MAX3396E bidirectional
level translators provide level shifting required for data
transfer in a multivoltage system. Internal slew-rate
enhancement circuitry features 10mA current-sink and
15mA current-source drivers to isolate capacitive loads
from lower current drivers. In open-drain systems, slew-
rate enhancement enables fast data rates with larger
pullup resistors and increased bus load capacitance.
Externally applied voltages, V
CC
and V
L
, set the logic-
high levels for the device. A logic-low signal on one I/O
side of the device appears as a logic-low signal on the
opposite I/O side and vice-versa. Each I/O line is pulled
up to V
CC
or V
L
by an internal pullup resistor, allowing
the devices to be driven by either push-pull or open-
drain drivers.
MAX3394E/MAX3395E/MAX3396E
±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/
Octal-Level Translators with Speed-Up Circuitry
_______________________________________________________________________________________ 7
Pin Description
PIN
MAX3394E MAX3395E MAX3396E
TDFN UCSP TQFN UCSP TQFN UCSP
NAME FUNCTION
1 A111B114D3V
CC
V
CC
Supply Voltage +1.65V ≤ V
CC
≤ +5.5V. Bypass
V
CC
to GND with a 0.1µF ceramic capacitor and a
1µF or greater ceramic capacitor as close to the
device as possible.
2 B1 6 B3 4 A4 EN
Enable Input. Drive EN logic high for normal
operation. Drive EN logic low to force all I/O lines to
a high-impedance state and disconnect internal
pullup resistors.
3 A2 10 C1 18 C1 I/O V
CC
1 I/O 1 Referred to V
CC
4 A3 9 C2 16 D1 I/O V
CC
2 I/O 2 Referred to V
CC
5 B3 5 B4 13 D4 GND Ground
6 C3 2 A2 20 A1 I/O V
L
2 I/O 2 Referred to V
L
7 C2 1 A1 19 B1 I/O V
L
1 I/O 1 Referred to V
L
8 C1 12 B2 3 A3 V
L
Logic Supply Voltage +1.2V ≤ V
L
≤ V
CC
. Bypass V
L
to GND with a 0.1µF or greater ceramic capacitor
as close to the device as possible.
— — 3 A3 1 B2 I/O V
L
3 I/O 3 Referred to V
L
— — 4 A4 2 A2 I/O V
L
4 I/O 4 Referred to V
L
— — 7 C4 15 D2 I/O V
CC
4 I/O 4 Referred to V
CC
— — 8 C3 17 C2 I/O V
CC
3 I/O 3 Referred to V
CC
— — — — 12 C3 I/O V
CC
5 I/O 5 Referred to V
CC
— — — — 11 D5 I/O V
CC
6 I/O 6 Referred to V
CC
— — — — 10 C4 I/O V
CC
7 I/O 7 Referred to V
CC
— — — — 9 C5 I/O V
CC
8 I/O 8 Referred to V
CC
— — — — 5 B3 I/O V
L
5 I/O 5 Referred to V
L
— — — — 6 A5 I/O V
L
6 I/O 6 Referred to V
L
— — — — 7 B4 I/O V
L
7 I/O 7 Referred to V
L
— — — — 8 B5 I/O V
L
8 I/O 8 Referred to V
L
EP — EP — EP — EP Exposed Pad. Connect exposed pad to GND.