Datasheet

MAX3301E/MAX3302E
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents
test setup, methodology, and results.
Human Body Model
Figure 22 shows the Human Body Model and Figure 23
shows the current waveform it generates when dis-
charged into a low impedance. This model consists of a
100pF capacitor charged to the ESD voltage of interest,
which is then discharged into the test device through a
1.5kΩ resistor.
IEC 61000-4-2
The IEC 61000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifi-
cally refer to integrated circuits. The MAX3301E/
MAX3302E helps the user design equipment that meets
level 3 of IEC 61000-4-2, without the need for additional
ESD-protection components. The major difference
between tests done using the Human Body Model and
IEC 61000-4-2 is a higher peak current in IEC 61000-4-2,
due to the fact that series resistance is lower in the IEC
61000-4-2 model. Hence, the ESD-withstand voltage
measured to IEC 61000-4-2 is generally lower than that
measured using the Human Body Model. Figure 24
shows the IEC 61000-4-2 model. The Air-Gap Discharge
test involves approaching the device with a charged
probe. The contact discharge method connects the
probe to the device before the probe is energized.
Figure 25 shows the IEC 61000-4-2 current waveform.
Layout Considerations
The MAX3301E/MAX3302E high operating frequency
makes proper layout important to ensure stability and
maintain the output voltage under all loads. For best
performance, minimize the distance between the
bypass capacitors and the MAX3301E/MAX3302E. Use
symmetric trace geometry from D+ and D- to the USB
connector.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, PC board tech-
niques, bump-pad layout, and the recommended reflow
temperature profile, as well as the latest information on
reliability testing results, refer to the Application Note:
Understanding the Basics of the Wafer-Level Chip-Scale
Package (WL-CSP) available on Maxim’s website at
www.maxim-ic.com/ucsp.
USB On-the-Go Transceivers and Charge Pumps
28 ______________________________________________________________________________________
BIT NUMBER SYMBOL CONTENTS
VALUE AT
POWER-UP
0 sdwn
Set to 0 to enable shutdown mode. Set to 1 for normal operation. Only the I
2
C
interface remains active in shutdown.
1
1 irq_mode
Set to 0 to set INT and OE/INT as open-drain outputs. Set to 1 to set INT and
OE/INT as push-pull outputs.
0
2 xcvr_input_disc
S et to 0 to l eave the D+ /D - si ng l e-end ed r ecei ver inp uts connected . S et to 1 to
d i sconnect the D + /D- r ecei ver inp uts to r educe p ow er consump ti on i n audi o mod e.
0
3 reg_sel Set to 0 to power TRM from V
CC
. Set to 1 to power TRM from V
BUS
.0
4–7 — Reserved. Set to 0 for normal operation. 0000
Table 16. MAX3302E Special-Function Register 2 (Write to Address 10h or 16h to Set,
Write to Address 11h or 17h to Clear)
REGISTER ADDRESS CONTENTS
00h 6Ah
Vendor ID
01h 0Bh
02h 01h
Product ID
03h 33h
14h 77h
Revision ID
15h 41h
Table 17. ID Registers