Datasheet

MAX3250
±50V Isolated, 3.0V to 5.5V,
250kbps, 2 TX/2 RX, RS-232 Transceiver
_______________________________________________________________________________________ 9
Chip Information
PROCESS: BiCMOS
RIN1
TOUT1
GND
V
CC
ISOCOM
V-
ISOVCC
V+
RIN2
TOUT2
TIN1
ROUT1
TIN2
ROUT2
C1-
C1+
C2-
C2+
C4+
C4-
C3+
C3-
CABLE
V
CC
C5
1µF
C1
0.47µF
GND
OFFSET
REMOTE
GROUND
MAX3250
FAULT
SHDN
MICRO
C2
0.47µF
C9
10nF
±50V
C6
2.2µF
C8
0.47µF
C7
0.47µF
C4
0.47µF
C3
0.1µF
REMOTE MICRO
REMOTE
XCVR
Typical Operating Circuit
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages
. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
28 SSOP A28M+3 21-0056 90-0095