Datasheet

MAX31725/MAX31726
±0.5°C Local Temperature Sensors
2Maxim Integrated
(All voltages relative to GND.)
Voltage Range on V
DD
, SDA, SCL, A0, A1 ............-0.3V to +4V
Voltage Range on A2, RESET, OS ........... -0.3V to (V
DD
+ 0.3V)
Input Current at Any Pin ................................................... +5mA
Package Input Current ................................................... +20mA
Continuous Power Dissipation (T
A
= +70NC)
TDFN (derate 24.4mW/NC above +70NC) ............... 1951.2mW
ESD Protection (All Pins, Human Body Model) (Note 1) .... Q4000V
Operating Temperature Range ........................ -55NC to +150NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) .....................................+260NC
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
(T
A
= -55
N
C to +150
N
C, unless otherwise noted.) (Notes 3, 4)
ELECTRICAL CHARACTERISTICS
(V
DD
= 2.5V to 3.7V, T
A
= -55
N
C to +150
N
C, unless otherwise noted. Typical values are V
DD
= 3.3V, T
A
= +25NC.) (Note 3)
Note 1: Human Body Model, 100pF discharged through a 1.5kI resistor.
TDFN
Junction-to-Ambient Thermal Resistance (q
JA
) ..........41°C/W
Junction-to-Case Thermal Resistance (q
JC
) .................8°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Operating Supply Voltage V
DD
2.5 3.3 3.7 V
Input High Voltage V
IH
V
DD
x 0.7 V
Input Low Voltage V
IL
V
DD
x 0.3 V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Accuracy (Note 5)
2.5V P + V
DD
P 3.7V, -40NC P T
A
P +105NC -0.5 ±0.1 +0.5
NC
2.5V P + V
DD
P 3.7V, -55NC P T
A
P +150NC -0.7 +0.7
Temperature Conversion Noise 0.0625 NC
Temperature Data Resolution 16 16 Bits
Conversion Time 44 50 ms
First Conversion Completed Data ready after POR 50 ms
Quiescent Supply Current I
DD
I
2
C inactive, T
A
= -40NC to +125NC 600 925
FA
Shutdown mode, I
2
C inactive, T
A
=
-40NC to +125NC
2.5 3.5
I
2
C inactive, T
A
= +150NC 800
Shutdown mode, I
2
C inactive,
T
A
= +150NC
4.2