Datasheet

SPI/I
2
C UART with 128-Word FIFOs
MAX3107
6 Maxim Integrated
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to AGND.)
V
L
, V
A
, V
EXT
, XIN ................................................ -0.3V to +4.0V
V
18
, XOUT .................................................. -0.3V to (V
A
+ 0.3V)
RST, IRQ, DIN/A1, CS/A0, SCLK/SCL,
DOUT/SDA, LDOEN, I
2
C/SPI .................. -0.3V to (V
L
+ 0.3V)
TX, RX, RTS/CLKOUT, CTS, GPIO_ ....... -0.3V to (V
EXT
+ 0.3V)
DGND .................................................................. -0.3V to +0.3V
Continuous Power Dissipation (T
A
= +70NC)
TQFN (derate 15.4mW/NC above +70NC) ................. 1229mW
SSOP (derate 12.3mW/NC above +70NC) ................... 988mW
Operating Temperature Range ........................ -40NC to +85NC
Junction Temperature ................................................... +150NC
Storage Temperature Range ........................... -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
DC ELECTRICAL CHARACTERISTICS
(V
A
= +2.35V to +3.6V, V
L
= +1.71V to +3.6V, V
EXT
= +1.71V to +3.6V, T
A
= -40NC to +85NC, unless otherwise noted. Typical values
are at V
A
= +2.8V, V
L
= +1.8V, V
EXT
= +2.5V, T
A
= +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) .......... 65NC/W
Junction-to-Case Thermal Resistance (B
JC
) ............... 15NC/W
SSOP
Junction-to-Ambient Thermal Resistance (B
JA
) ........... 81NC/W
Junction-to-Case Thermal Resistance (B
JC
) ............... 32NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Digital Interface Supply Voltage V
L
1.71 3.6 V
Analog Supply Voltage V
A
2.35 3.6 V
UART Interface Logic Supply
Voltage
V
EXT
1.71 3.6 V
Logic Supply Voltage V
18
1.65 1.80 1.95 V
CURRENT CONSUMPTION
V
A
Supply Current I
A
1.8MHz crystal oscillator active, PLL dis-
abled, V
LDOEN
= V
L,
SPI/I
2
C interface idle
220 500 FA
Baud rate = 1Mbps, external clock, SPI
frequency is 8MHz, external loopback PLL
disabled, V
LDOEN
= V
L
(Note 3)
0.65 1.3 mA
V
A
Shutdown Supply Current I
A, SHDN
Shutdown mode, V
LDOEN
= 0V, V
RST
= 0V,
all inputs and outputs are idle
20 35 FA
V
A
Sleep Supply Current I
A, SLEEP
Sleep mode, V
LDOEN
= V
L
, V
RST
= V
L,
all
inputs and outputs are idle
45 100 FA
V
L
Supply Current I
L
All logic inputs are at V
L
or V
EXT
or 0V 4 15 FA
V
EXT
Supply Current I
EXT
All logic inputs are at V
L
or V
EXT
or 0V 5 10 FA
V
18
Input Power-Supply Current
in Shutdown Mode
I
18SHDN
V
LDOEN
= 0V (V
18
is powered by an exter-
nal 1.85V voltage source), static power
consumption
7 50 FA