Datasheet

___________________________________________________Typical Operating Circuit

CTS

RTS

TXDIN

DOUT

SPI/MICROWIRE

RS-232 I/O

SCLK

MAX3100

IRQ

MAX3223

μC

SPI/MICROWIRE-Compatible

UART in QSOP-16

___________________Chip Information

PROCESS: BiCMOS

SUBSTRATE CONNECTED TO GND

PACKAGE TYPE PACKAGE CODE DOCUMENT NO.

14 Plastic DIP P14-3

21-0043

16 QSOP E16-1

21-0055

24 TQFN-EP T2444-4

21-0139

Package Information

For the latest package outline information and land patterns, go

to www.maxim-ic.com/packages

MAX3100

Maxim Integrated

MAX3100