Datasheet

50MHz to 500MHz Analog VGA, 1735MHz to 1935MHz
Upconverting Mixer with Image Filtering, Threshold
Alarm Circuit, and Error Amplifier for Level Control
MAX2091
2
V
CC_A
, V
CC_IF
, V
CC_LO
, V
CC_RF
............................ -0.3V to +6V
IF_IN, MIX_IN, IF_OUT, LO+, RF_OUT
.......-0.3V to V
CC
+ 0.3V
ALM, R_BIAS, DET_VIN, AMP_OUT, LO-
............-0.3V to +3.6V
ALM_THRES, PLVLSET,
CTRL1, CTRL2
..........-0.3V to MINIMUM (V
CC
+ 0.3V, +3.6V)
IF_IN, MIX_IN Input Power
........................................... +15dBm
Continuous Power Dissipation (Note 1)
..............................2.5W
Operating Case Temperature
Range (Note 2)
............................................... -40NC to +95NC
Maximum Junction Temperature
.......................................150NC
Storage Temperature Range
............................ -65NC to +150NC
Lead Temperature (soldering 10s)
...................................300NC
Soldering Temperature (reflow)
......................................+260NC
Junction-to-Ambient Thermal Resistance (q
JA
)
(Notes 3, 4)
............................................................... +29°C/W
Junction-to-Case Thermal Resistance (q
JC
)
(Notes 1, 4)
................................................................. +7°C/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Based on junction temperature T
J
= T
C
+ (θ
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150°C.
Note 2:
T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
Note 3:
Junction temperature T
J
= T
A
+ (θ
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150
NC.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS
DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V
CC
= 4.75V to 5.8V, V
GND
= 0V, P
LO
= -10dBm to -4dBm, and T
C
= -40°C to +95°C. Typical values are
at V
CC
= 5.5V, P
LO
= -7dBm, and T
C
= +25°C, unless otherwise noted.) (Note 5)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
CC
4.75 5.5 5.8 V
Total Supply Current I
DC
CTRL1 = 1, CTRL2 = 1 264 290
mACTRL1 = 1, CTRL2 = 0 254
CTRL1 = 0, CTRL2 = 0 8.5 15
CTRL1/CTRL2 Logic-Low Input Voltage V
IL
0.8 V
CTRL1/CTRL2 Logic-High Input Voltage V
IH
2.2 V
CTRL1/CTRL2 Input Logic Current I
IH
/I
IL
-10 10
FA
PLVLSET Input Resistance R
IN
650
kI
PLVLSET Input Voltage Range 0 2.5 V
PLVLSET Minimum Control Voltage 0 0.1 0.2 V
PLVLSET Maximum Control Voltage 2.3 2.4 2.5 V
DET_IN Input Voltage Range V
IN
0 2.5 V
ALM_THRES Input Resistance 90 135
kI
Alarm Output Logic 1 3.135 3.3 3.465 V
Alarm Output Logic 0 0.4 V
DET_VIN Input Resistance 175 235 295
kI