Datasheet
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MAX2090
50MHz to 1000MHz Analog VGA and Power
Detector with Optional AGC Loop
V
CC_A
, V
CC_RF
........................................................-0.3V to +6V
RF_IN, RF_OUT ........................................ -0.3V to (V
CC
+ 0.3V)
R_BIAS, ALM_THRES, PLVLSET,
GCTRL, FLTR ...................................................-0.3V to +3.6V
CTRL1, CTRL2 .....................................................-0.3V to +3.6V
ALM ......................................................................-0.3V to +3.6V
DET_VOUT ..........................................................-0.3V to +3.6V
RF_IN Input Power ........................................................ +15dBm
RF_OUT Output Power ................................................. +20dBm
DET_IN Input AC Voltage Swing ............. -0.3V to (V
CC
+ 3.0V)
Continuous Power Dissipation (Note 1) ..............................2.5W
Operating Case Temperature Range (Note 2) .. -40NC to +95NC
Maximum Junction Temperature .....................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
TQFN
Junction-to-Ambient Thermal Resistance q
JA
(Notes 3, 4) ..+29NC/W
Junction-to-Case Thermal Resistance q
JC
(Notes 1, 4) .........7NC/W
ABSOLUTE MAXIMUM RATINGS
Note 3: Junction temperature T
J
= T
A
+ (q
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS
DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V
CC
= 4.75V to 5.8V, V
GND
= 0V, and T
C
= -40NC to +95NC. Typical values are at V
CC
= 5.0V,
V
PLVLSET
= 1.65V, and T
C
= +25NC, unless otherwise noted.)
Note 1: Based on junction temperature T
J
= T
C
+ (q
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150NC.
Note 2: T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
CC
4.75 5.0 5.8 V
Total Supply Current I
DC
CTRL1 = X, CTRL2 = 1 85 110
mACTRL1 = 1, CTRL2 = 0 75 100
CTRL1 = 0, CTRL2 = 0 8 15
CTRL1/CTRL2 Logic-Low Input
Voltage
V
IL
0.8 V
CTRL1/CTRL2 Logic-High Input
Voltage
V
IH
2.2 V
CTRL1/CTRL2 Input Logic
Current
I
IH
, I
IL
-10 +10
FA
PLVLSET Input Resistance R
IN
650
kI
PLVLSET Input Voltage Range 0 2.5 V
PLVLSET Minimum Control
Voltage
0 0.1 0.2 V