Datasheet

MAX2078
Octal-Channel Ultrasound Front-End
with CW Doppler Mixers
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
REF
= 2.475V to 2.525V, V
CC1
= 3.13V to 3.47V, V
CC2
= 4.5V to 5.25V, T
A
= 0°C to +70°C, V
GND
= 0V,
CLP = 0, PD = 0, no RF signals applied. Typical values are at V
CC1
= 3.3V, V
CC2
= 4.75V, T
A
= +25°C, unless otherwise noted.) (Note 5)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC_
to GND .........................................................-0.3V to +5.5V
V
CC2
- V
CC1
......................................................................> -0.3V
CI_, CQ_ to GND ....................................................-0.3V to +13V
ZF_, IN_, AG to GND ................................-0.3V to (V
CC_
+ 0.3V)
INC_ ..............................................................................20mA DC
V
REF
to GND.............................................................-0.3V to +3V
IN_ to AG ...............................................................-0.6V to +0.6V
OUT_, LO_, DIN, DOUT, VG_, NP, CS, CLK, PD,
CLP, V/C to GND......................................-0.3V to V
CC1
+ 0.3V
CI_, CQ_, V
CC_
, V
REF
analog and digital control signals must
be applied in this order
Input Differential Voltage .............................2.0V
P-P
differential
Continuous Power Dissipation (T
A
= +70°C)
68-Pin TQFN (derated 40mW/°C above +70°C) ..................4W
Operating Temperature Range (Note 1).................0°C to +70°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-40°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
3.3V Supply Voltage V
CC1
3.13 3.3 3.47 V
4.75V/5V Supply Voltage V
CC2
4.5 4.75 5.25 V
E xter nal Refer ence V ol tag e Rang eV
REF
(Note 6) 2.475 2.525 V
CMOS Input High Voltage V
IH
Applies to CMOS control inputs 2.5 V
CMOS Input Low Voltage V
IL
Applies to CMOS control inputs 0.8 V
CMOS Input Leakage Current I
IN
T
A
= + 25
o
C , ap p l i es to C M O S contr ol i np uts;
0 to 3.47V
10 µA
DATA Output High Voltage DOUT_HI 10MΩ load V
CC1
V
DATA Output Low Voltage DOUT_LO 10MΩ load 0 V
DC ELECTRICAL CHARACTERISTICS—VGA MODE
( Typical Application Circuit , V
REF
= 2.475V to 2.525V, V
CC1
= 3.13V to 3.47V, V
CC2
= 4.5V to 5.25V, T
A
= 0°C to +70°C, V
GND
= 0V,
NP = 0, V/C = 1, CLP = 0, PD = 0, no RF signals applied. Typical values are at V
CC1
= 3.3V, V
CC2
= 4.75V, T
A
= +25°C, unless other-
wise noted.) (Note 5)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
4.75V /5V S up p l y S tand b y C ur r ent I_NP_5V_TOT NP = 1, all channels 3.9 6 mA
3V Supply Standby Current I_NP_3V_TOT NP = 1, all channels 1.7 3 mA
4.75V/5V Power-Down Current I_PD_5V_TOT PD = 1, all channels 0.4 10 µA
Note 2: Junction temperature T
J
= T
C
+ (θ
JC
x V
CC
x I
CC
). This formula can only be used if the component is soldered down to a printed
circuit board pad containing multiple ground vias to remove the heat. The junction temperature must not exceed 150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
Note 4: Junction temperature T
J
= T
A
+ (θ
JA
x V
CC
x I
CC
), assuming there is no heat removal from the exposed pad. The junction
temperature must not exceed 150°C.
64 TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
)........20°C/W
Junction-to-Case Thermal Resistance (θ
JC
)............0.5°C/W
PACKAGE THERMAL CHRACTERISTICS (Notes 2, 3, 4)