Datasheet

MAX2055
package. This pad should be connected to the ground
plane of the board by using multiple vias under the
device to provide the best RF/thermal conduction path.
Solder the exposed pad on the bottom of the device
package to a PC board exposed pad.
The MAX2055 Evaluation Kit can be used as a refer-
ence for board layout. Gerber files are available upon
request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V
CC
pin with a
1000pF and 100pF capacitor. Connect the 100pF
capacitor as close to the device as possible. Resistor
R7 helps reduce switching transients. If switching tran-
sients are not a concern, R7 is not required. Therefore,
connect pin 9 directly to V
CC
.
Exposed Paddle RF Thermal
Considerations
The EP of the MAX2055’s 20-pin TSSOP-EP package
provides a low thermal-resistance path to the die. It is
important that the PC board on which the IC is mounted
be designed to conduct heat from this contact. In addi-
tion, the EP provides a low-inductance RF ground path
for the device.
It is recommended that the EP be soldered to a ground
plane on the PC board, either directly or through an
array of plated via holes.
Soldering the pad to ground is also critical for efficient
heat transfer. Use a solid ground plane wherever
possible.
Digitally Controlled, Variable-Gain, Differential
ADC Driver/Amplifier
12 ______________________________________________________________________________________
ATTENUATION B4 B3* B2 B1 B0
0 00000
1 00001
2 00010
3 00011
4 00100
5 00101
6 00110
7 00111
8 01000
9 01001
10 01010
11 01011
12 01100
13 01101
14 01110
15 01111
16 1 X 0 0 0
17 1 X 0 0 1
18 1 X 0 1 0
19 1 X 0 1 1
20 1 X 1 0 0
21 1 X 1 0 1
22 1 X 1 1 0
23 1 X 1 1 1
Table 3. Attenuation Setting vs. Gain-
Control Bits
* Enabling B4 disables B3 and the minimum attenuation is
16dB.
Chip Information
TRANSISTOR COUNT: 325
PROCESS: BiCMOS