Datasheet
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MAX2042A
SiGe High-Linearity, 1600MHz to 3900MHz
Upconversion/Downconversion Mixer with LO Buffer
V
CC
to GND ..........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS to GND ......................... -0.3V to (V
CC
+ 0.3V)
RF, LO Input Power ....................................................... +20dBm
IF Input Power (50ω source) ......................................... +18dBm
RF, LO Current (RF and LO are DC shorted to
GND through a balun) ....................................................50mA
Operating Case Temperature Range (Note 1) ....... -40NC to +85NC
Continuous Power Dissipation (Note 2) ..............................5.0W
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering 10s) .................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Note 1: T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
Note 2: Based on junction temperature T
J
= T
C
+ (B
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150NC.
Note 3: Junction temperature T
J
= T
A
+ (B
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
TQFN
Junction-to-Ambient
Thermal Resistance B
JA
(Notes 3, 4) ....................... +38°C/W
Junction-to-Case
Thermal Resistance B
JC
(Notes 2, 4) ....................... +13°C/W
PACKAGE THERMAL CHARACTERISTICS
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V
CC
= 4.75V to 5.25V, no input AC signals. T
C
= -40NC to +85NC, unless otherwise noted. Typical values
are at V
CC
= 5.0V, T
C
= +25NC.)
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V
CC
= 3.0V to 3.6V, no input AC applied. T
C
= -40NC to +85NC, unless otherwise noted. Typical values
are at V
CC
= 3.3V, T
C
= +25NC.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
CC
4.75 5 5.25 V
Supply Current I
CC
140 162 mA
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
CC
3.0 3.3 3.6 V
Supply Current I
CC
122 mA