Datasheet

MAX2031
High-Linearity, 650MHz to 1000MHz Upconversion/
Downconversion Mixer with LO Buffer/Switch
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
to GND...........................................................-0.3V to +5.5V
RF (RF is DC shorted to GND through a balun)..................50mA
LO1, LO2 to GND ..................................................-0.3V to +0.3V
IF+, IF- to GND ...........................................-0.3V to (V
CC
+ 0.3V)
TAP to GND ...........................................................-0.3V to +1.4V
LOSEL to GND ...........................................-0.3V to (V
CC
+ 0.3V)
LOBIAS to GND..........................................-0.3V to (V
CC
+ 0.3V)
RF, LO1, LO2 Input Power (Note 1) ...............................+20dBm
Continuous Power Dissipation (Note 2)....................................5W
θj
A
(Notes 3, 4)...............................................................+38°C/W
θj
C
(Notes 2, 3) ..............................................................+13°C/W
Operating Temperature Range (Note 5) .....T
C
= -40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
CC
= 4.75V to 5.25V, no RF signals applied, T
C
= -40°C to +85°C. IF+ and IF- are DC grounded through an
IF balun. Typical values are at V
CC
= 5V, T
C
= +25°C, unless otherwise noted.)
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
CC
4.75 5.00 5.25 V
Supply Current I
CC
85 100 mA
LOSEL Input-Logic Low V
IL
0.8 V
LOSEL Input-Logic High V
IH
2V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
C om p onents tuned for the 700M H z b and
( Tab l e 1) , C 1 = 7p F, C 5 = 3.3p F ( N otes 6, 7)
650 850
RF Frequency f
RF
C om p onents tuned for the 800M H z/900M H z
cel l ul ar b and ( Tab l e 1) , C 1 = 82p F,
C 5 = 2.0p F ( N ote 6)
800 1000
MHz
LO Frequency f
LO
(Notes 6, 7) 650 1250 MHz
IF Frequency f
IF
IF frequency range depends on external IF
transformer selection
0 250 MHz
LO Drive Level P
LO
(Note 6) -3 +3 dBm
Note 1: Maximum, reliable, continuous input power applied to the RF and IF port of this device is +12dBm from a 50Ω source.
Note 2: Based on junction temperature T
J
= T
C
+ (θ
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the
Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
Note 4: Junction temperature T
J
= T
A
+ (θ
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 5: T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.