Datasheet

MAX2023
High-Dynamic-Range, Direct Up-/Downconversion
1500MHz to 2500MHz Quadrature Mod/Demod
2
ABSOLUTE MAXIMUM RATINGS
VCC_ to GND ........................................................-0.3V to +5.5V
BBI+, BBI-, BBQ+, BBQ- to GND..................-4V to (V
CC
+ 0.3V)
LO, RF to GND Maximum Current ......................................30mA
RF Input Power ...............................................................+30dBm
Baseband Differential I/Q Input Power ..........................+20dBm
LO Input Power...............................................................+10dBm
RBIASLO1 Maximum Current .............................................10mA
RBIASLO2 Maximum Current .............................................10mA
RBIASLO3 Maximum Current .............................................10mA
Continuous Power Dissipation (Note 1) ...............................7.6W
Operating Case Temperature Range (Note 2) ....-40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
DC ELECTRICAL CHARACTERISTICS
(MAX2023 Typical Application Circuit , V
CC
= 4.75V to 5.25V, GND = 0V, I/Q inputs terminated into 50Ω to GND, LO input terminated into
50Ω, RF output terminated into 50Ω, 0V common-mode input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, T
C
= -40°C to +85°C, unless otherwise
noted. Typical values are at V
CC
= 5V, T
C
= +25°C, unless otherwise noted.)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Supply Voltage 4.75 5.00 5.25 V
Supply Current (Note 5) 255 295 345 mA
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Based on junction temperature T
J
= T
C
+ (θ
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the
Applications Information section for details.
The junction temperature must not exceed +150°C.
Note 2: T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
Note 3: Junction temperature T
J
= T
A
+ (θ
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
PACKAGE THERMAL CHARACTERISTICS
TQFN
Junction-to-Ambient
Thermal Resistance (θ
JA
) (Notes 3, 4) .......................+34°C/W
Junction-to-Case
Thermal Resistance (θ
JC
) (Notes 1, 4) ......................+8.5°C/W
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF Frequency (Note 6) f
RF
1500 2500 MHz
LO Frequency (Note 6) f
LO
1500 2500 MHz
IF Frequency (Note 6) f
IF
1000 MHz
LO Power Range P
LO
-3 +3 dBm