Datasheet

MAX2023
High-Dynamic-Range, Direct Up-/Downconversion
1500MHz to 2500MHz Quadrature Mod/Demod
16
1
2
3
4
5
6
7
8
9
10
11 12
13 14
TQFN
(6mm x 6mm)
15
16 17
18
27
26
25
24
23
22
21
20
EP
19
36
35
34
33 32
31
30 29
28
Σ
BIAS
LO2
BIAS
LO1
90°
0°
BIAS
LO3
GND
BBI+
BBI-
GND
RF
GND
BBQ-
BBQ+
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
+
RBIASLO3
VCCLOA
LO
GND
RBIASLO1
N.C.
RBIASLO2
GND
GND GND
VCCLOQ2
GND
GND
GND
GND
MAX2023
VCCLOI1
VCCLOI2
VCCLOQ1
Pin Configuration/Functional Diagram
Chip Information
PROCESS: SiGe BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages
. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
TQFN T3666+2
21-0141 90-0049