Datasheet
Maxim Integrated
│
24
MAX2022 High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
www.maximintegrated.com
Table 1. Component List Referring to the Typical Application Circuit
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
PROCESS:SiGeBiCMOS
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
*EP = Exposed pad.
Ordering Information
COMPONENT VALUE DESCRIPTION
C1,C6,C7,C10,C13 22pF 22pF±5%,50VC0Gceramiccapacitors(0402)
C2, C5, C8, C11, C12 0.1µF 0.1µF±10%,16VX7Rceramiccapacitors(0603)
C3
22pF
22pF±5%,50VC0Gceramiccapacitor(0402),f
LO
= 1500MHz to 2400MHz
6.8pF
6.8pF±5%,50VC0Gceramiccapacitor(0402),f
LO
= 2400MHz to 3000MHz
C9
1.2pF
1.2pF±0.1pF,50VC0Gceramiccapacitor(0402),f
RF
= 1500MHz to 2400MHz
22pF
22pF±5%,50VC0Gceramiccapacitor(0402),f
RF
= 2400MHz to 3000MHz
C16
Short
Replacewithashortcircuitor0Ωresistor(0402),f
RF
= 1500MHz to 2400MHz
0.7pF
0.7pF±0.1pF,50VC0Gceramiccapacitor(0402),f
RF
= 2400MHz to 3000MHz
L1
Not Used Not installed for f
RF
= 1500MHz to 2400MHz
4.7nH
4.7nH±0.3nHinductor(0402)forf
RF
= 2400MHz to 3000MHz
R1 432Ω
432Ω±1%resistor(0402)
R2 562Ω 562Ω±1%resistor(0402)
R3 301Ω 301Ω±1%resistor(0402)
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
TQFN-EP
(6mm x 6mm)
T3666+2
21-0141 90-0049
PART TEMP RANGE PIN-PACKAGE
MAX2022ETX+ -40°C to +85°C 36 TQFN-EP*
MAX2022ETX+T -40°C to +85°C 36 TQFN-EP*