Datasheet

Maxim Integrated │ 2
MAX2022 High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
www.maximintegrated.com
DC Electrical Characteristics
(MAX2022 Typical Application Circuit, V
CC
=4.75Vto5.25V,V
GND
=0V,I/Qportsterminatedinto50ΩtoGND,LOandRFports
terminatedinto50ΩtoGND,R1=432Ω,R2=562Ω,R3=301Ω,T
C
= -40°C to +85°C, unless otherwise noted. Typical values are at
V
CC
= 5V, T
C
= +25°C, unless otherwise noted.)
Recommended AC Operating Conditions
VCC_toGND ....................................................... -0.3V to +5.5V
BBIP,BBIN,BBQP,BBQNtoGND .......... -2.5V to (V
CC
+ 0.3V)
LO,RFtoGNDMaximumCurrent ..................................... 50mA
RF Input Power
..............................................................+20dBm
Baseband Differential I/Q Input Power
...........................+20dBm
LO Input Power
..............................................................+10dBm
RBIASLO1 Maximum Current
............................................10mA
RBIASLO2 Maximum Current
............................................10mA
RBIASLO3 Maximum Current
............................................10mA
Continuous Power Dissipation (Note 1)
..............................7.6W
Operating Case Temperature Range (Note 2)
... -40°C to +85°C
Maximum Junction Temperature
.....................................+150°C
Storage Temperature Range
............................ -65°C to +150°C
Lead Temperature (soldering, 10s)
.................................+300°C
Soldering Temperature (reflow)
....................................... +260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
TQFN
Junction-to-Ambient
ThermalResistance(θ
JA
) (Notes 3, 4) .....................+34°C/W
Junction-to-Case
ThermalResistance(θ
JC
) (Notes 1, 4) ....................+8.5°C/W
Absolute Maximum Ratings
Note 1: Based on junction temperature T
J
= T
C
+(θ
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
Note 3: Junction temperature T
J
= T
A
+(θ
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 4: PackagethermalresistanceswereobtainedusingthemethoddescribedinJEDECspecificationJESD51-7,usingafour-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
CC
4.75 5.00 5.25 V
Total Supply Current I
TOTAL
Pins 3, 13, 15, 31, 33 all connected to V
CC
292 342 mA
Total Power Dissipation 1460 1796 mW
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF Frequency f
RF
(Note 5) 1500 3000 MHz
LO Frequency f
LO
(Note 5) 1500 3000 MHz
IF Frequency f
IF
(Note 5) 1000 MHz
LO Power Range P
LO
-3 +3 dBm