Datasheet
MAX2021
High-Dynamic-Range, Direct Up-/Downconversion
650MHz to 1200MHz Quadrature Mod/Demod
16
Maxim Integrated
Note: V
CC
= 5V, P
LO
= 0dBm, T
A
= +25°C, I/Q voltage levels = 1.4V
P-P
differential.
LO FREQ
(MHz)
RF FREQ
(MHz)
R1
(ΩΩ
ΩΩ
)
R2
(ΩΩ
ΩΩ
)
R3
(ΩΩ
ΩΩ
)
I
CC
(mA)
OIP3
(dBm)
LO LEAK
(dBm)
IMAGE REJ
(dBc)
OIP2
(dBm)
420 620 330 271 19.6 -32.1 23.9 50.5
453 665 360 253 21.9 -32.7 34.0 51.0
499 698 402 229 18.9 -33.7 30.0 52.6
549 806 464 205 15.7 -34.4 23.7 46.0
800 801.8
650 1000 550 173 13.6 -34.2 23.3 32.3
420 620 330 271 20.7 -31.4 43.4 54.0
453 665 360 253 21.6 -31.6 42.4 55.4
499 698 402 229 20.6 -31.8 42.7 59.8
549 806 464 205 19.0 -31.9 40.3 50.7
900 901.8
650 1000 550 173 14.9 -30.5 25.0 34.6
420 620 330 271 22.4 -32.8 39.3 55.5
453 665 360 253 22.2 -33.2 39.1 56.3
499 698 402 229 19.9 -33.8 43.5 55.0
549 806 464 205 17.6 -34.8 40.5 51.4
1000 1001.8
650 1000 550 173 14.6 -33.9 36.8 32.8
Table 1. Typical Performance Trade-Offs as a Function of Current Draw—Modulator Mode
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass all VCC_ pins with
33pF and 0.1µF capacitors placed as close to the pins
as possible. The smallest capacitor should be placed
closest to the device.
To achieve optimum performance, use good voltage-
supply layout techniques. The MAX2021 has several
RF processing stages that use the various VCC_
pins, and while they have on-chip decoupling, off-
chip interaction between them may degrade gain, lin-
earity, carrier suppression, and output power-control
range. Excessive coupling between stages may
degrade stability.
Exposed Pad RF/Thermal Considerations
The EP of the MAX2021’s 36-pin TQFN-EP package
provides a low thermal-resistance path to the die. It is
important that the PCB on which the IC is mounted be
designed to conduct heat from this contact. In addition,
the EP provides a low-inductance RF ground path for
the device.
The exposed pad (EP) MUST be soldered to a ground
plane on the PCB either directly or through an array of
plated via holes. An array of 9 vias, in a 3 x 3 array, is
suggested. Soldering the pad to ground is critical for
efficient heat transfer. Use a solid ground plane wher-
ever possible.