Datasheet

MAX2016
LF-to-2.5GHz Dual Logarithmic Detector/
Controller for Power, Gain, and VSWR Measurements
______________________________________________________________________________________ 17
MAX2016
REFSETA OUTA OUTB SETB
2.0V
REF
LOG
AMPLIFIERS
LOG
AMPLIFIERS
V
CC
RFINB+
RFINB-
FB1
FB2
FV1
FV2
SETDOUTDCSETH COUTH COUTL
CSETL
COR
FA2
FA1
RFINA-
RFINA+
GND
EXPOSED
PAD
20k
Ω
50
Ω
50
Ω
20k
Ω
20k
Ω
20k
Ω
2, 9, 12, 20
5, 17
3
4
1
28
8
16 15 11 10
13
14
22
21
18
19
2423252726
67
20k
Ω
Functional Diagram
planes. This method provides a good RF/thermal con-
duction path for the device. Solder the exposed pad on
the bottom of the device package to the PCB. The
MAX2016 Evaluation Kit can be used as a reference for
board layout. Gerber files are available upon request at
www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V
CC
pin with a
capacitor as close to the pin as possible (Typical
Application Circuit).
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX2016’s 28-pin thin
QFN-EP package provides two functions. One is a low
thermal-resistance path to the die; the second is a low-
RF impedance ground connection. The EP MUST be
soldered to a ground plane on the PCB, either directly
or through an array of plated via holes (minimum of four
holes to provide ground integrity).