Datasheet

250MHz to 4000MHz Dual,
Analog Voltage Variable Attenuator
MAX19790
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
V
CC
to GND ..........................................................-0.3V to +5.5V
CTRL to GND (with V
CC
= +5.0V applied) ............ 0V to +4.75V
All Other Pins to GND .............................. -0.3V to (V
CC
+ 0.3V)
RF Input ......................................................................... +20dBm
Current into CTRL Pin (V
CC
grounded) .............................40mA
Maximum Junction Temperature .....................................+150°C
Operating Temperature Range .......................... -40°C to +85°C
Storage Temperature Range ........................….-65°C to +150°C
Continuous Power Dissipation (T
C
= +85°C) (Note 1) .......2.1W
θ
JC
(Notes 2, 4) ............................................................ +10°C/W
θ
JA
(Notes 3, 4) ............................................................ +35°C/W
Lead Temperature (soldering, 10s) ................................+300°C
Soldering Temperature (reflow) ......................................+260°C
DC ELECTRICAL CHARACTERISTICS
(V
CC
= +4.75V to +5.25V, V
CTRL
= +1.0V to +4.0V, no RF signals applied, all input and output ports terminated with 50I, T
C
=
-40°C to +85°C, unless otherwise noted. Typical values are at V
CC
= +5.0V, V
CTRL
= +1.0V, T
C
= +25°C, unless otherwise noted.)
RECOMMENDED AC OPERATING CONDITIONS
ABSOLUTE MAXIMUM RATINGS
Note 1: T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
Note 2: Based on junction temperature T
J
= T
C
+ (θ
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 3: Junction temperature T
J
= T
A
+ (θ
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
CAUTION! ESD SENSITIVE DEVICE
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SUPPLY
Supply Voltage V
CC
4.75 5.0 5.25 V
Supply Current I
CC
7.3 9.5 mA
CONTROL INPUT
Control Voltage Range V
CTRL
(Note 5) 1.0 4.0 V
Control Input Resistance R
CTRL
50
kI
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF Frequency Range f
RF
(Note 6) 250 4000 MHz