Datasheet

Integrated Temperature
Controllers for Peltier Modules
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
DD
= PV
DD
1 = PV
DD
2 = V
SHDN
= 5V, FREQ = GND, CTLI = FB+ = FB- = MAXV = MAXIP = MAXIN = REF, T
A
= 0°C to +85°C,
unless otherwise noted. Typical values at T
A
= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
DD
to GND..............................................................-0.3V to +6V
SHDN, MAXV, MAXIP, MAXIN,
CTLI, OT, UT to GND............................................-0.3V to +6V
FREQ, COMP, OS1, OS2, CS, REF, ITEC, AIN+, AIN-,
AOUT, INT-, INTOUT, BFB+, BFB-, FB+, FB-,
DIFOUT to GND......................................-0.3V to (V
DD
+ 0.3V)
PV
DD
1, PV
DD
2 to V
DD
...........................................-0.3V to +0.3V
PV
DD
1, PV
DD
2 to GND...............................-0.3V to (V
DD
+ 0.3V)
PGND1, PGND2 to GND .......................................-0.3V to +0.3V
COMP, REF, ITEC, OT, UT, INTOUT, DIFOUT,
BFB-, BFB+, AOUT Short to GND .............................Indefinite
Peak LX Current (MAX1978) (Note 1).................................±4.5A
Peak LX Current (MAX1979) (Note 1)....................................+9A
Continuous Power Dissipation (T
A
= +70°C)
48-Lead Thin QFN-EP
(derate 26.3mW/°C above +70°C) (Note 2).................2.105W
Operating Temperature Ranges
MAX1978ETM ..................................................-40°C to +85°C
MAX1979ETM ..................................................-40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input Supply Range V
DD
3.0 5.5 V
V
DD
= 5V, I
TEC
= 0 to ±3A,
V
OUT
= V
OS1
- V
OS2
(MAX1978)
-4.3 +4.3
V
DD
= 5V, I
TEC
= 0 to 6A,
V
OUT
= V
OS1
(MAX1979)
4.3
V
DD
= 3V, I
TEC
= 0 to ±3A,
V
OUT
= V
OS1
- V
OS2
(MAX1978)
-2.3 +2.3
Output Voltage Range V
OUT
V
DD
= 3V, I
TEC
= 0 to 6A,
V
OUT
= V
OS1
(MAX1979)
2.3
V
MAX1978 ±3
Maximum TEC Current I
TEC
(
MAX
)
MAX1979 6
A
Reference Voltage V
REF
V
DD
= 3V to 5.5V, I
REF
= 150µA 1.485 1.500 1.515 V
Reference Load Regulation ∆V
REF
V
DD
= 3V to 5.5V, I
REF
= +10µA to -1mA 1.2 5 mV
V
MAXI_
= V
REF
135 150 160
V
OS1
< V
CS
V
MAXI_
= V
REF
/3 40 50 60
V
MAXI_
= V
REF
135 150 160
Current-Sense Threshold
V
OS1
> V
CS
V
MAXI_
= V
REF
/3 40 50 60
mV
V
DD
= 5V, I = 0.5A 0.04 0.07
NFET On-Resistance R
DS
(
ON-N
)
V
DD
= 3V, I = 0.5A 0.06 0.08
Ω
V
DD
= 5V, I = 0.5A 0.06 0.10
PFET On-Resistance R
DS
(
ON-P
)
V
DD
= 3V, I = 0.5A 0.09 0.12
Ω
V
LX
= V
DD
= 5V, T
A
= +25°C 0.02 10
NFET Leakage I
LEAK
(
N
)
V
LX
= V
DD
= 5V, T
A
= +85°C1
µA
Note 1: LX has internal clamp diodes to PGND and PVDD. Applications that forward bias these diodes should not exceed the IC’s
package power dissipation limits.
Note 2: Solder underside metal slug to PCB ground plane.
MAX1978/MAX1979
2
Maxim Integrated