Datasheet

MAX17598/MAX17599
Low I
Q
, Wide-Input Range, Active Clamp
Current-Mode PWM Controllers
2Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
IN
= 12V (for MAX17598, bring V
IN
up to 21V for startup), V
CS
= V
DITHER
= V
FB
= V
OVI
= V
SGND
= V
PGND
= 0V, V
EN/UVLO
= +2V,
AUXDRV = NDRV = SS = COMP = SLOPE = unconnected, R
RT
= 25kI, R
DT
= 10kI, C
VIN
= 1FF, C
VDRV
= 1FF, T
A
= T
J
= -40NC to
+125NC, unless otherwise noted. Typical values are at T
A
= T
J
= +25NC.) (Note 2)
V
IN
(MAX17599 only) ............................................-0.3V to +40V
V
DRV
to SGND
(MAX17598 Only) ..............................................-0.3V to +16V
(MAX17599 Only) ................................................-0.3V to +6V
EN/UVLO to SGND ..................................... -0.3V to (V
IN
+ 0.3V)
NDRV, AUXDRV to PGND .......................-0.3V to (V
DRV
+ 0.3V)
OVI, RT, DITHER, COMP, SS, FB,
SLOPE, DT to SGND ..........................................-0.3V to +6V
CS to SGND ............................................................-0.8V to +6V
PGND to SGND ....................................................-0.3V to +0.3V
Maximum Input/Output Current (Continuous)
V
IN
, V
DRV
......................................................................100mA
NDRV (pulsed for less than 100ns) .........................+0.9A/-1.5A
AUXDRV (pulsed for less than 100ns) .....................+0.3A/-0.7A
Continuous Power Dissipation (T
A
= +70NC)
TQFN (derate 20.8mW/°C above 70°C) .................... 1666mW
Operating Temperature Range ........................ -40°C to +125°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
Soldering Temperature (reflow) ......................................+260°C
TQFN
Junction-to-Case Thermal Resistance (q
JC
) .................7°C/W
Junction-to-Ambient Thermal Resistance (q
JA
) ..........48°C/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
INPUT SUPPLY (V
IN
)
V
IN
Voltage Range V
IN
MAX17598 8 29
V
MAX17599 4.5 36
V
IN
Bootstrap UVLO Wakeup V
IN-UVR
IN rising
MAX17598 18.5 20 21.5
V
MAX17599 3.8 4.1 4.4
V
IN
Bootstrap UVLO
Shutdown Level
V
IN-UVF
IN falling
MAX17598 6.5 7 7.5
V
MAX17599 3.6 3.9 4.2
V
IN
Supply Startup Current
(under UVLO)
I
IN-
STARTUP
V
IN
< UVLO 20 32 FA
V
IN
Supply Shutdown
Current
I
IN-SH
V
EN
= 0V 20 32 FA
V
IN
Supply Current I
IN-SW
Switching, f
SW
= 400kHz 2 mA
V
IN
Clamp Voltage V
INC
V
EN
= 0V, I
IN
= 2mA sinking
(MAX17598) (Note 3)
30 33 36 V
ENANBLE (EN)
EN Threshold
V
ENR
V
EN
rising 1.16 1.21 1.26
V
V
ENF
V
EN
falling 1.1 1.15 1.20
EN Input Leakage Current I
EN
V
EN
= 1.5V, T
A
= +25NC -100 +100 nA