Datasheet

MAX17595/MAX17596/MAX17597
Peak-Current-Mode Controllers for
Flyback and Boost Regulators
2Maxim Integrated
V
IN
to SGND .......................................................... -0.3V to +40V
V
DRV
to SGND ..................................-0.3V to +16V (MAX17595)
V
DRV
to SGND ..........-0.3V to +6V (MAX17596 and MAX17597)
NDRV to SGND .................................... -0.3V to +(V
DRV
+ 0.3)V
EN/UVLO to SGND .................................. -0.3V to +(V
IN
+ 0.3)V
OVI, RT, DITHER, COMP, SS, FB,
SLOPE to SGND .................................................... -0.3V to +6V
CS to SGND ............................................................-0.8V to +6V
PGND to SGND ....................................................-0.3V to +0.3V
Maximum Input/Output Current (Continuous)
V
IN
, V
DRV
..........................................................................100mA
NDRV (pulsed, for less than 100ns) .......................... 1.5A/-0.9A
Continuous Power Dissipation TQFN (single-layer board)
(derate 20.8mW/NC above +70NC) ............................1666mW
Operating Temperature Range ........................ -40NC to +125NC
Storage Temperature Range ............................ -65NC to +150NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
IN
= 12V (for the MAX17595, bring V
IN
up to 21V for startup), V
CS
= V
SLOPE
= V
DITHER
= V
FB
= V
OVI
= V
SGND
= V
PGND
= 0V,
V
EN/UVLO
= +2V; NDRV, SS, COMP are unconnected, R
RT
= 25kI, C
VIN
= 1FF, C
VDRV
= 1FF, T
A
= T
J
= -40NC to +125NC, unless
otherwise noted. Typical values are at T
A
= T
J
= +25NC.) (Note 2)
Junction-to-Ambient Thermal Resistance (q
JA
) ..............48°C/W Junction-to-Case Thermal Resistance (q
JC
) .....................7°C/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
INPUT SUPPLY (VIN)
VIN Voltage Range VIN
MAX17595 8 29
V
MAX17596/MAX17597 4.5 36
VIN Bootstrap UVLO
Wakeup
VIN-UVR
VIN rising #
MAX17595 18.5 20 21.5
V
MAX17596/MAX17597 3.8 4.1 4.4
VIN Bootstrap UVLO
Shutdown Level
VIN-UVF
VIN falling $
MAX17595 6.5 7 7.5
V
MAX17596/MAX17597 3.6 3.9 4.2
VIN Supply Startup Current
(Under UVLO)
IVIN-
STARTUP
VIN < UVLO 20 32
FA
VIN Supply Shutdown
Current
IIN-SH VEN = 0V 20 32
FA
VIN Supply Current IIN-SW Switching, fSW = 400kHz 2 mA
VIN Clamp Voltage VINC
MAX17595, IVIN = 2mA sinking, VEN = 0V (Note
3)
30 33 36 V
ENABLE (EN)
EN Undervoltage
Threshold
VENR
VEN rising #
1.16 1.21 1.26
V
VENF
VEN falling $
1.1 1.15 1.2
EN Input Leakage Current IEN
VEN = 1.5V, TA = +25NC
-100 +100 nA