Datasheet

Maxim Integrated │ 2
MAX17503 4.5V-60V, 2.5A, High-Efciency,
Synchronous Step-Down DC-DC Converter
With Internal Compensation
www.maximintegrated.com
Electrical Characteristics
(V
IN
= V
EN/UVLO
=24V,R
RT
= 40.2kI(500kHz),C
VCC
=2.2μF,V
PGND
= V
SGND
= V
MODE
= V
SYNC
= 0V, LX = SS = RESET = open,
V
BST
to V
LX
= 5V, V
FB
= 1V, T
A
= T
J
= -40ºC to +125ºC, unless otherwise noted. Typical values are at T
A
= +25ºC. All voltages are
referencedtoSGND,unlessotherwisenoted.)(Note2)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
V
IN
toPGND .........................................................-0.3V to +65V
EN/UVLOtoSGND ...............................................-0.3V to +65V
LXtoPGND................................................-0.3V to (V
IN
+ 0.3V)
BSTtoPGND ........................................................-0.3V to +70V
BST to LX .............................................................-0.3V to +6.5V
BST to V
CC
...........................................................-0.3V to +65V
CF, RESET, SS, MODE, SYNC,
RTtoSGND .....................................................-0.3V to +6.5V
FBtoSGND .........................................................-0.3V to +1.5V
V
CC
toSGND .......................................................-0.3V to +6.5V
SGNDtoPGND ....................................................-0.3V to +0.3V
LXTotalRMSCurrent ...........................................................±4A
Output Short-Circuit Duration .................................... Continuous
Continuous Power Dissipation (T
A
= +70ºC) (multilayer board)
TQFN (derate 30.3mW/ºC above T
A
= +70ºC) ......2424.2mW
OperatingTemperatureRange ..........................-40NC to +125ºC
Junction Temperature ...................................................... +150ºC
StorageTemperatureRange .............................-65NC to +160ºC
Lead Temperature (soldering, 10s) ................................. +300ºC
Soldering Temperature (reflow) ....................................... +260ºC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TQFN
Junction-to-AmbientThermalResistance(θ
JA
) ..........33ºC/W
Junction-to-CaseThermalResistance(θ
JC
) .................2ºC/W
Absolute Maximum Ratings
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
INPUT SUPPLY (V
IN
)
InputVoltageRange V
IN
4.5 60 V
Input Shutdown Current I
IN-SH
V
EN/UVLO
= 0V (shutdown mode) 2.8 4.5
µA
Input Quiescent Current
I
Q_PFM
V
FB
=1V,MODE=RT=open 118
V
FB
= 1V, MODE = open 162
I
Q-DCM
DCM mode, V
LX
= 0.1V 1.16 1.8
mA
I
Q_PWM
Normal switching mode, f
SW
=500kHz,V
FB
= 0.8V
9.5
ENABLE/UVLO (EN/UVLO)
EN/UVLO Threshold
V
ENR
V
EN/UVLO
rising 1.19 1.215 1.26
V
V
ENF
V
EN/UVLO
falling 1.068 1.09 1.131
EN/UVLO Input Leakage Current I
EN
V
EN/UVLO
= 0V, T
A
= +25ºC -50 0 +50 nA
LDO
V
CC
OutputVoltageRange V
CC
6V < V
IN
< 60V, I
VCC
= 1mA
4.75 5 5.25 V
1mA≤I
VCC
≤25mA
V
CC
Current Limit I
VCC-MAX
V
CC
= 4.3V, V
IN
= 6V 26.5 54 100 mA
V
CC
Dropout V
CC-DO
V
IN
= 4.5V, I
VCC
= 20mA 4.2 V
V
CC
UVLO
V
CC_UVR
V
CC
rising 4.05 4.2 4.3
V
V
CC_UVF
V
CC
falling 3.65 3.8 3.9