Datasheet

MAX17502 60V, 1A, Ultra-Small, High-Efciency,
Synchronous Step-Down DC-DC Converter
www.maximintegrated.com
Maxim Integrated │ 2
Electrical Characteristics
(V
IN
= 24V, V
GND
= V
PGND
= 0V, C
VIN
=2.2μF,C
VCC
=1μF,V
EN
= 1.5V, C
SS
= 3300pF, V
FB
= 0.98 x V
OUT
, LX = unconnected,
RESET = unconnected. T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C. All voltages are refer-
encedtoGND,unlessotherwisenoted.)(Note2)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
V
IN
toGND.............................................................-0.3Vto+70V
EN/UVLOtoGND.......................................-0.3V to (V
IN
+ 0.3V)
LXtoPGND................................................-0.3V to (V
IN
+ 0.3V)
FB,RESET,COMP,SStoGND .............................-0.3V to +6V
V
CC
toGND..............................................................-0.3Vto+6V
GNDtoPGND.......................................................-0.3Vto+0.3V
LXTotalRMSCurrent.........................................................±1.6A
Output Short-Circuit Duration.....................................Continuous
OperatingTemperatureRange.........................-40°Cto+125°C
Junction Temperature......................................................+150°C
StorageTemperatureRange.............................-65°Cto+160°C
Lead Temperature (soldering, 10s).................................+300°C
Soldering Temperature (reflow).......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
10 TDFN
Continuous Power Dissipation (T
A
= +70°C)
(derate 14.9mW/°C above +70°C) (multilayer board) .1188.7mW
Junction-to-AmbientThermalResistance(θ
JA
) ...........67.3°C/W
Junction-to-CaseThermalResistance(θ
JC
) ................18.2°C/W
14 TSSOP
Continuous Power Dissipation (T
A
= +70°C)
(derate 25.6mw/°C above +70°C) ..........................2051.3mW
Junction-to-AmbientThermalResistance(θ
JA
) ..............39°C/W
Junction-to-CaseThermalResistance(θ
JC
) .....................3°C/W
Absolute Maximum Ratings
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
INPUT SUPPLY (V
IN
)
InputVoltageRange V
IN
4.5 60 V
Input Supply Current
I
IN-SH
V
EN
= 0V, shutdown mode 0.9 3.5 µA
I
IN-SW
Normal
switching mode,
no load
MAX17502E/F/G 4.75 6.75
mA
MAX17502H 2.5 3.6
ENABLE/UVLO (EN/UVLO)
EN Threshold
V
ENR
V
EN
rising 1.194 1.218 1.236
VV
ENF
V
EN
falling 1.114 1.135 1.156
V
EN-TRUESD
V
EN
falling, true shutdown 0.7
EN Input Leakage Current I
EN
V
EN
= V
IN
= 60V, T
A
= +25°C 8 200 nA
LDO
V
CC
OutputVoltageRange V
CC
6V < V
IN
< 12V, 0mA < I
VCC
< 10mA,
12V < V
IN
< 60V, 0mA < I
VCC
< 2mA
4.65 5 5.35 V
V
CC
Current Limit I
VCC-MAX
V
CC
= 4.3V, V
IN
= 12V 15 40 80 mA
V
CC
Dropout V
CC-DO
V
IN
= 4.5V, I
VCC
= 5mA 4.1 V
V
CC
UVLO
V
CC-UVR
V
CC
rising 3.85 4 4.15
V
V
CC-UVF
V
CC
falling 3.55 3.7 3.85