Datasheet
MAX17501 60V, 500mA, Ultra-Small, High-Efciency,
Synchronous Step-Down DC-DC Converter
www.maximintegrated.com
Maxim Integrated
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17
Figure 4. Recommended Component Placement for MAX17501A/B/E/F
PCB Layout Guidelines
CarefulPCBlayoutiscriticaltoachievelowswitchingloss-
es and stable operation. For a sample layout that ensures
first-pass success, refer to the MAX17501 evaluation kit
layouts available at www.maximintegrated.com. Follow
theseguidelinesforgoodPCBlayout:
1) All connections carrying pulsed currents must be very
short and as wide as possible. The loop area of these
connections must be made very small to reduce stray
inductance and radiated EMI.
2) A ceramic input filter capacitor should be placed close
to the V
IN
pin of the device. The bypass capacitor for
the V
CC
pin should also be placed close to the V
CC
pin. External compensation components should be
placed close to the IC and far from the inductor. The
feedback trace should be routed as far as possible
from the inductor.
3) The analog small-signal ground and the power ground
for switch ing currents must be kept separate. They
should be connected together at a point where switch-
ing activity is at minimum, typically the return terminal
EP
R4
C2
C1
R2
R1
V
IN
PLANE
PGND PLANE
GND PLANE
VIAS TO BOTTOM SIDE PGND PLANE
VIAS TO BOTTOM SIDE V
OUT
TRACK
VIAS TO BOTTOM SIDE GND PLANE
L1
V
OUT
PLANE
LX PLANE
C3
RESET
C4