Datasheet
MAX16993 Step-Down Controller with
Dual 2.1MHz Step-Down DC-DC Converters
www.maximintegrated.com
Maxim Integrated
│
2
Electrical Characteristics
(V
SUP
= 14V, V
PV1
= V
BIAS
, V
PV2
= V
PV3
= V
OUT1
; T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at
T
A
= +25°C under normal conditions, unless otherwise noted.) (Note 2)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
Side-Wettable QFND
Junction-to-AmbientThermalResistance(θ
JA
) ......... 37°C/W
Junction-to-CaseThermalResistance(θ
JC
) ............ 2.8°C/W
TQFN
Junction-to-AmbientThermalResistance(θ
JA
) ......... 29°C/W
Junction-to-CaseThermalResistance(θ
JC
) ............ 1.7°C/W
V
SUP
, EN1 to GND ...............................................-0.3V to +45V
PV_ to GND..........................................................-0.3V to +6.0V
PV_ to GND..........................................................-0.3V to +6.0V
PV2 to GND, PV2 to PGND2 ...............................-0.3V to +6.0V
PV3 to GND, PV3 to PGND3 ...............................-0.3V to +6.0V
PGND2–PGND3 to GND......................................-0.3V to +0.3V
LX1 to GND ...............................................-6.0V to V
SUP
+ 6.0V
BST1 to LX1 .........................................................-0.3V to +6.0V
DH1 to LX1 ...............................................-0.3V to BST1 + 0.3V
BIAS to GND ........................................................-0.3V to +6.0V
DL1 to GND ................................................. -0.3V to PV1 + 0.3V
LX2 to PGND2.............................................-0.3V to PV2 + 0.3V
LX3 to PGND3.............................................-0.3V to PV3 + 0.3V
OUT1, CS1, OUT2, OUT3 to GND ......................-0.3V to +6.0V
FB1, EN2, EN3 to GND........................................-0.3V to +6.0V
RESET_, ERR to GND .........................................-0.3V to +6.0V
CS1 to OUT1 ........................................................ -0.3V to +0.3V
CSEL1, SYNC, SSEN to GND .............................-0.3V to +6.0V
COMP1 to GND... ..........................................-0.3V to PV + 0.3V
LX2, LX3 Output Short-Circuit Duration .................... Continuous
Continuous Power Dissipation (T
A
= +70ºC)
Side-Wettable QFND (derate 27mW/ºC above +70ºC)......2160mW
TQFN (derate 34.5mW/ºC above +70ºC)...............2758.6mW
Operating Temperature Range ..........................-40ºC to +125°C
Junction Temperature ...................................................... +150°C
Storage Temperature Range .............................-65ºC to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) ....................................... +260°C
Absolute Maximum Ratings
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage Startup
Threshold
V
SUP,STARTUP
V
SUP
rising 4.25 4.5 4.75 V
Supply Voltage Range V
SUP
Normal operation, after Buck 1 startup 3.5 36 V
Supply Current I
SUP
V
EN1
= V
EN2
= V
EN3
= 0V 4 15
µA
V
EN1
= 5V, V
EN2
= V
EN3
= 0V (no load) 20 40
Oscillator Frequency f
SW
2.0 2.1 2.2 MHz
SYNC Input Frequency
Range
1.7 2.4 MHz
Spread-Spectrum Range
V
SSEN
= V
GND
0
%
V
SSEN
= V
BIAS
+6
BIAS Regulator Voltage V
BIAS
6V≤V
SUP
≤42V,noswitchover 4.6 5.0 5.4 V
PV_ POR
V
BIAS
falling 2.5 2.7 2.9
V
Hysteresis 0.45