Datasheet

High-Voltage, 2.2MHz, 2A Automotive Step-
Down Converter with Low Operating Current
MAX16974
2 ______________________________________________________________________________________
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
SUP, SUPSW, EN to GND .....................................-0.3V to +45V
SUP to SUPSW, LX ...............................................-0.3V to +0.3V
BST to GND ..........................................................-0.3V to +47V
BST to LX ...............................................................-0.3V to +6V
OUT to GND ..........................................................-0.3V to +12V
RESETI, FOSC, COMP, BIAS, FSYNC, CRES,
RES, FB to GND ..................................................-0.3V to +6V
Output Short-Circuit Duration ....................................Continuous
Continuous Power Dissipation (T
A
= +70NC)
TSSOP (derate 26.1mW/NC above +70NC) ........... 2088.8mW*
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(V
SUP
= V
SUPSW
= 14V, L1 = 4.7FH, V
EN
= 14V, C
IN
= 10FF, C
OUT
= 22FF, C
BIAS
= 1FF, C
BST
= 0.1FF, C
CRES
= 1nF, R
FOSC
=
12.1kI, T
A
= T
J
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.)
ABSOLUTE MAXIMUM RATINGS
*As per JEDEC 51 standard (multilayer board).
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (q
JA
) ........38.3°C/W
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
SUP
Normal operation 3.5 28 V
Supply Current I
SUP
Normal operation, I
LOAD
= 1.5A 2 3 mA
Skip mode, no load, V
OUT
= 5V 35 50
FA
Shutdown Supply Current V
EN
= 0V 5 10
FA
BIAS Regulator Voltage V
BIAS
V
SUP
= V
SUPSW
= 6V to 42V, V
OUT
> 6V 4.9 5.1 5.4 V
BIAS Undervoltage Lockout V
UVBIAS
V
BIAS
rising 2.85 3.05 3.25 V
BIAS Undervoltage Lockout
Hysteresis
V
UVBIAS_
HYS
350 mV
Thermal-Shutdown Threshold 175
NC
OUTPUT VOLTAGE (OUT)
Output Voltage V
OUT
Normal operation, V
FB
= V
BIAS
, I
LOAD
= 2A,
T
A
= +25°C
4.95 5 5.05
V
Normal operation, V
FB
= V
BIAS
, I
LOAD
= 2A,
-40°C < T
A
<+125°C
4.9 5 5.1
Skip-Mode Output Voltage V
OUT_SKIP
No load, V
FB
= V
BIAS
(Note 2) 4.95 5.05 5.2 V
Load Regulation V
OUT
= 5V, V
FB
= V
BIAS
; 400mA < I
LOAD
< 2A 1 %
Line Regulation 6V < V
SUP
< 28V 0.02 %/V
BST Input Current I
BST
100% duty cycle, V
BST
- V
LX
= 5V 1.5 3 mA
LX Current Limit I
LX
2.5 3 3.5 A
Skip-Mode Current Threshold I
SKIP_TH
240 mA