Datasheet

High-Voltage, 2.2MHz, 2A Automotive Step-
Down Converter with Low Operating Current
MAX16974
18 _____________________________________________________________________________________
4) Keep the power traces and load connections short. This
practice is essential for high efficiency. Use thick cop-
per PCBs (2oz vs. 1oz) to enhance full-load efficiency.
5) The analog signal lines should be routed away from
the high-frequency planes. This ensures integrity of
sensitive signals feeding back into the IC.
6) The ground connection for the analog and power sec-
tion should be close to the IC. This keeps the ground
current loops to a minimum. In cases where only one
ground is used, enough isolation between analog return
signals and high power signals must be maintained.
7) Ensure a high-frequency decoupling capacitor of 0.1µF
is placed next to the SUP pin of the IC. This capacitor
prevents high-frequency noise from entering the SUP
pin. Adding a resistor between the SUPSW and SUP
pins along with the decoupling capacitor at the SUP
pin is recommended to reduce noise sensitivity.
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
16 TSSOP-EP U16E+3
21-0108 90-0120