Datasheet

MAX16962
4A, 2.2MHz, Synchronous Step-Down
DC-DC Converter
11Maxim Integrated
PCB Layout Guidelines
Careful PCB layout is critical to achieve low switching
losses and clean, stable operation. Use a multilayer
board whenever possible for better noise immunity and
power dissipation. Follow these guidelines for good PCB
layout:
1) Use a large contiguous copper plane under the
MAX16962 package. Ensure that all heat-dissipating
components have adequate cooling. The bottom
pad of the MAX16962 must be soldered down to
this copper plane for effective heat dissipation and
maximizing the full power out of the MAX16962. Use
multiple vias or a single large via in this plane for
heat dissipation.
2) Isolate the power components and high current path
from the sensitive analog circuitry. This is essential to
prevent any noise coupling into the analog signals.
3) Add small footprint blocking capacitors with low
self-resonance frequency close to PV1, PV2, and PV.
4) Keep the high-current paths short, especially at the
ground terminals. This practice is essential for stable,
jitter-free operation. The high current path composed
of input capacitors at PV1, PV2, inductor, and the
output capacitor should be as short as possible.
5) Keep the power traces and load connections short.
This practice is essential for high efficiency. Use
thick copper PCBs (2oz vs. 1oz) to enhance full-load
efficiency.
6) OUTS are sensitive to noise for devices with external
feedback option. The resistive network, R1, R2, and
C1 must be placed close to OUTS and far away from
the LX_ node and high switching current paths. The
ground node of R2 must be close to GND.
7) The ground connection for the analog and power
section should be close to the IC. This keeps the
ground current loops to a minimum. In cases where
only one ground is used enough isolation between
analog return signals and high power signals must be
maintained.