Datasheet

MAX16955
36V, 1MHz Step-Down Controller
with Low Operating Current
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
SUP
= V
EN
= 14V, C
IN
= 10μF, C
OUT
= 94μF, C
BIAS
= 2.2μF, C
BST
= 0.1μF, R
FOSC
= 76.8kΩ, T
A
= T
J
= -40°C to +125°C, unless
otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial
.
SUP and EN to SGND ............................................-0.3V to +42V
LX to PGND ..............................................................-1V to +42V
BST to LX .................................................................-0.3V to +6V
BIAS, FB, PGOOD, FSYNC to SGND .......................-0.3V to +6V
DH to LX ...................................................................-0.3V to +6V
DL to PGND .............................................-0.3V to (V
BIAS
+ 0.3V)
FOSC to SGND ........................................-0.3V to (V
BIAS
+ 0.3V)
CS and OUT to SGND ............................................-0.3V to +11V
PGND to SGND .....................................................-0.3V to +0.3V
Continuous Power Dissipation (T
A
= +70°C)
TSSOP (derate 26.1mW/°C above +70°C) .............2088.8mW*
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (θ
JA
) .........38.3°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ...................3°C/W
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SUP Input Voltage Range V
SUP
(Note 3) 3.5 36 V
SUP Operating Supply Current I
SUP
Fixed 5V output, fixed-frequency, PWM
mode, V
FB
= V
BIAS
, no external FETs
connected
1 mA
Skip Mode Supply Current I
SKIP
No load, fixed 5V output 50 90 μA
SUP Shutdown Supply Current I
SHDN,SUP
V
EN
= 0V 10 20 μA
V
SUP
= 3.5V, I
BIAS
= 45mA 3.0
BIAS Voltage V
BIAS
6V < V
SUP
< 36V 4.7 5.0 5.3
V
BIAS Undervoltage Lockout V
UVBIAS
V
BIAS
rising 3.1 3.4 V
BIAS Undervoltage Lockout
Hysteresis
V
BIAS
falling 200 mV
BIAS Minimum Load I
BIAS(MIN)
V
SUP
- V
BIAS
> 200mV 45 mA
OUTPUT VOLTAGE (OUT)
Output Voltage Adjustable
Range
1.0 10 V
OUT Pulldown Resistance R
PULL_D
V
EN
= 0V or fault condition active 30 
Output Voltage (5V Fixed Mode) V
OUT
V
SUP
= 6V to 36V, V
FB
= V
BIAS
, fixed-
frequency mode (Note 4)
4.925 5.0 5.075 V
FB Feedback Voltage
(Adjustable Mode)
V
FB
V
SUP
= 6V to 36V, 0V < (V
CS
- V
OUT
)
< 80mV, fixed-frequency mode
0.99 1.0 1.01 V
FB Current I
FB
V
FB
= 1.0V 0.02 μA
* As per JEDEC51 standard (multilayer board).