Datasheet

MAX16936
36V, 220kHz to 2.2MHz Step-Down Converter
with 28µA Quiescent Current
2Maxim Integrated
SUP, SUPSW, LX, EN to PGND ............................-0.3V to +42V
SUP to SUPSW .....................................................-0.3V to +0.3V
BIAS to AGND .........................................................-0.3V to +6V
SYNCOUT, FOSC, COMP, FSYNC,
PGOOD, FB to AGND ........................-0.3V to (V
BIAS
+ 0.3V)
OUT to PGND ........................................................ -0.3V to +12V
BST to LX .................................................................-0.3V to +6V
AGND to PGND ................................................... -0.3V to + 0.3V
LX Continuous RMS Current ...................................................3A
Output Short-Circuit Duration .................................... Continuous
Continuous Power Dissipation (T
A
= +70NC)*
TSSOP (derate 26.1mw/NC above +70NC) .............2088.8mW
TQFN (derate 28.6mw/NC above +70NC) ...............2285.7mW
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
*As per JEDEC51 standard (multilayer board).
TSSOP
Junction-to-Ambient Thermal Resistance (B
JA
) .......38.3NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................3NC/W
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) ..........35
N
C/W
Junction-to-Case Thermal Resistance (B
JC
) ..............2.7NC/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(V
SUP
= V
SUPSW
= 14V, V
EN
= 14V, L1 = 2.2FH, C
IN
= 4.7FF, C
OUT
= 22FF, C
BIAS
= 1FF, C
BST
= 0.1FF, R
FOSC
= 12kI,
T
A
= T
J
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
SUP
, V
SUPSW
3.5 36 V
Load Dump Event Supply
Voltage
V
SUP_LD
t
LD
< 1s 42 V
Supply Current I
SUP_STANDBY
Standby mode, no load, VOUT = 5V,
V
FSYNC
= 0V
28 40 FA
Shutdown Supply Current I
SHDN
V
EN
= 0V 5 8 FA
BIAS Regulator Voltage V
BIAS
V
SUP
= V
SUPSW
= 6V to 42V,
I
BIAS
= 0 to 10mA
4.7 5 5.4 V
BIAS Undervoltage Lockout V
UVBIAS
V
BIAS
rising 2.95 3.15 3.40 V
BIAS Undervoltage Lockout
Hysteresis
450 650 mV
Thermal Shutdown Threshold +175 NC
Thermal Shutdown Threshold
Hysteresis
15 NC