Datasheet

MAX16932/MAX16933
2.2MHz, 36V, Dual Buck
with 20µA Quiescent Current
2Maxim Integrated
IN, EN1, EN2, TERM to PGND_ ............................-0.3V to +42V
CS1, CS2, OUT1, OUT2 to AGND ........................-0.3V to +11V
CS1 to OUT1 ........................................................-0.2V to +0.2V
CS2 to OUT2 ........................................................-0.2V to +0.2V
BIAS, FSYNC, FOSC to AGND .............................-0.3V to +6.0V
COMP1, COMP2 to AGND ...................................-0.3V to +6.0V
FB1, FB2, EXTVCC to AGND ...............................-0.3V to +6.0V
DL_ to PGND_ ..................................................... -0.3V to +6.0V
BST_, to LX_ .......................................................-0.3V to + 6.0V
DH_ to LX_ ..........................................................-0.3V to + 6.0V
LX_ to PGND_ .......................................................-0.3V to +42V
PGND_ to AGND ..................................................-0.3V to +0.3V
PGOOD1, PGOOD2 to AGND.......... ...................-0.3V to +6.0V
Continuous Power Dissipation (T
A
= +70NC)
TQFN (derate 28.6mW/NC above +70NC)...............2285.7mW
Operating Temperature Range. ....................... -40NC to +125NC
Junction Temperature Range ..........................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow)...................................... +260NC
TQFN
Junction-to-Ambient Thermal Resistance (q
JA
) ..........35°C/W Junction-to-Case Thermal Resistance (q
JC
) .................3°C/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(V
IN
= 14V, V
BIAS
= 5V, C
BIAS
= 6.8µF, T
A
= T
J
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC
under normal conditions, unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT
SYNCHRONOUS STEP-DOWN DC-DC CONTROLLERS
Supply Voltage Range V
IN
Normal operation 3.5 36
V
t < 1s 42
Output Overvoltage Threshold
FB rising (Note 3) +10 +15 +20
%
FB falling +5 +10 +15
Supply Current I
IN
V
EN1
= V
EN2
= 0V, T
A
= +25NC 8 20
FA
V
EN1
= V
EN2
= 0V, T
A
= +125NC 20
V
EN1
= 5V, V
OUT1
= 5V, V
EN2
= 0V;
V
EXTVCC
= 5V, no switching
30 40
V
EN2
= 5V, V
OUT2
= 3.3V; V
EN1
= 0V,
V
EXTVCC
= 3.3V, no switching
20 30
V
EN1
= V
EN2
= 5V, V
OUT1
= 5V, V
OUT2
=
3.3V,
EXTVCC
= 3.3V, no switching
25 40
Buck 1 Fixed Output Voltage V
OUT1
V
FB1
= V
BIAS
, PWM mode 4.95 5 5.05
V
V
FB1
= V
BIAS
, skip mode 4.95 5 5.075
Buck 2 Fixed Output Voltage V
OUT2
V
FB2
= V
BIAS
, PWM mode 3.234 3.3 3.366
V
V
FB2
= V
BIAS
, skip mode 3.234 3.3 3.4
Output Voltage Adjustable
Range
Buck 1, buck 2 1 10 V