Datasheet

4 Maxim Integrated
200mA, Automotive, Ultra-Low
Quiescent Current, Linear Regulator
MAX16910
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
IN, ENABLE, SET.................................................. -0.3V to +45V
OUT, RESET (open-drain output)............................-0.3V to +12V
SETOV, TIMEOUT....................................................-0.3V to +6V
Maximum Current (all pins except IN and OUT)...............50mA
Continuous Power Dissipation (T
A
= +70°C)
TDFN (derate 24.4mW/°C above +70°C)*.............1951mW
SO (derate 23.3mW/°C above +70°C)*................1861mW
Operating Temperature Range..........................-40°C to +125°C
Junction Temperature......................................................+150°C
Storage Temperature Range..............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
Soldering Temperature (reflow) ......................................+260°C
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
IN
= V
ENABLE
= +14V, C
TIMEOUT
= open, C
IN
= 1µF, C
OUT
= 4.7µF, unless otherwise noted. T
A
= -40°C to +125°C, T
A
P T
J
P
+150°C, unless otherwise noted. Typical values are T
A
= +25°C.) (Note 2)
*As per JEDEC51 Standard (multilayer board).
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (q
JA
) ........... 41°C/W
Junction-to-Case Thermal Resistance (q
JC
) ..................8°C/W
SO
Junction-to-Ambient Thermal Resistance (q
JA
) ........... 53°C/W
Junction-to-Case Thermal Resistance (q
JC
) ..................7°C/W
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage Range V
IN
Continuous 3.5 30
V
For P 400ms
45
Supply Current I
LOAD
= 0mA, SET = GND, V
OUT
= 5V 20 30
FA
Shutdown Supply Current I
SHDN
ENABLE = GND, T
A
= +25NC
1.6 3
FA
ENABLE = GND, -40NC P T
A
P +125NC
3
Output Voltage
(5V Fixed Output Setting)
V
OUT50
1mA P I
LOAD
P 200mA,
V
IN
= 6V to 30V (Note 3)
4.9 5.0 5.1
V
1mA P I
LOAD
P 50mA,
V
IN
= 6V to 30V, T
J
= +150°C (Notes 3, 4)
4.9 5.0 5.1
Output Voltage
(3.3V Fixed Output Setting)
V
OUT33
1mA P I
LOAD
P 200mA, V
IN
= 4.8V to 30V
(Note 3)
3.234 3.3 3.366
V
1mA P I
LOAD
P 50mA, V
IN
= 4.8V to 30V,
T
J
= +150°C (Notes 3, 4)
3.234 3.3 3.366
Adjustable Output-Voltage Range V
OUT
1.5 11.0 V
SETOV FB Voltage V
SETOV
I
LOAD
= 1mA (Note 4) 1.225 1.25 1.275 V
Dropout Voltage (Note 5)
DV
DO
I
LOAD
= 200mA, SET = GND, SETOV =
HIGH, V
OUT(NORM)
= +5.0V
280 600
mV
I
LOAD
= 50mA, SET = GND, SETOV =
HIGH, V
OUT(NORM)
= +5.0V, T
J
= +150°C
(Notes 3, 4)
600