Datasheet

2Maxim Integrated
MAX16909
36V, 220kHz to 1MHz Step-Down Converter
with Low Operating Current
SUP, SUPSW, LX, EN to GND ...............................-0.3V to +42V
SUP to SUPSW .....................................................-0.3V to +0.3V
BST to GND ........................................................... -0.3V to +47V
BST to LX ...............................................................-0.3V to +6V
OUT to GND ..........................................................-0.3V to +12V
FOSC, COMP, BIAS, FSYNC, I.C., PGOOD,
FB to GND ............................................................-0.3V to +6V
LX Continuous RMS Current ...................................................4A
Output Short-Circuit Duration .................................... Continuous
Continuous Power Dissipation (T
A
= +70NC)
TSSOP (derate 26.1mW/
o
C above +70NC) .......... 2088.8mW*
TQFN (derate 28.6mW/
o
C above +70NC) ............ 2285.7mW*
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ..................................... +260
o
C
TSSOP
Junction-to-Ambient Thermal Resistance (B
JA
) .......38.3NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................3NC/W
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) ..........35NC/W
Junction-to-Case Thermal Resistance(B
JC
) ...............2.7NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(V
SUP
= V
SUPSW
= 14V, V
EN
= 14V, R
FOSC
= 66.5kI, T
A
= T
J
= -40NC to +125NC, unless otherwise noted. Typical values are at
T
A
= +25NC.)
*As per the JEDEC 51 standard (multilayer board).
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage Range
V
SUP
,
V
SUPSW
3.5 36 V
Load-Dump Event Supply
Voltage
V
SUP_LD
t
LD
< 1s 42 V
Supply Current
I
SUP
I
LOAD
= 1.5A 3.5 mA
I
SUP_STANDBY
Standby mode, no load, V
OUT
= 5V 30 60
FA
Standby mode, no load, V
OUT
= 5V,
T
A
= +25°C
30 45
Shutdown Supply Current I
SHDN
V
EN
= 0V 5 12 FA
BIAS Regulator Voltage V
BIAS
V
SUP
= V
SUPSW
= 6V to 36V 4.7 5 5.5 V
BIAS Undervoltage Lockout V
UVBIAS
V
BIAS
rising 2.9 3.1 3.3 V
BIAS Undervoltage-Lockout
Hysteresis
400 mV
Thermal-Shutdown Threshold +175 NC
Thermal-Shutdown Threshold
Hysteresis
15 NC
OUTPUT VOLTAGE (OUT)
Output Voltage V
OUT
V
FB
= V
BIAS,
normal operation 4.925 5 5.075 V