Datasheet

MAX16903

2.1MHz, High-Voltage, 1A Mini-Buck Converter

Maxim Integrated

Chip Information

PROCESS: BiCMOS

PACKAGE

TYPE

PACKAGE

CODE

OUTLINE

NO.

LAND

PATTERN NO.

10 TDFN-EP T1033+1

21-0137 90-0003

16 TSSOP-EP U16E+3

21-0108 90-0120

Package Information

For the latest package outline information and land patterns (foot-

prints), go to www.maximintegrated.com/packages

. Note that a

“+”, “#”, or “-” in the package code indicates RoHS status only.

Package drawings may show a different suffix character, but the

drawing pertains to the package regardless of RoHS status.