Datasheet
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
38 TQFN-EP T3857M+1 21-0172 90-0007
TOP VIEW
MAX16809
TQFN
+
13
14
15
16
17
18
19
DOUT
SET
V+
PGND
PGND
DIN
CLK
38
37
36
35
34
33
32
1 2 3 4 5 6 7 8 9 10 11 12
N.C.
REF
N.C.
V
CC
OUT
AGND
N.C.
OE
OUT15
OUT14
OUT13
OUT12
OUT11
OUT10
OUT9
OUT8
COMP
FB
N.C.
31 30 29 28 27 26 25 24 23 22 21 20
LE
OUT0
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
RTCT
CS
N.C.
www.maximintegrated.com
Maxim Integrated
│
19
MAX16809 Integrated 16-Channel LED Driver with
Switch-Mode Boost and SEPIC Controller
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
PROCESS: BiCMOS
Pin Conguration










