Datasheet

MAX153 1Msps, µP-Compatible,
8-Bit ADC with 1µA Power-Down
www.maximintegrated.com
Maxim Integrated │ 12
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages.Note
thata“+”,“#”,or“-”inthepackagecodeindicatesRoHSstatus
only.Packagedrawingsmayshowadifferentsuffixcharacter,but
thedrawingpertainstothepackageregardlessofRoHSstatus.
Chip Information
PROCESS:BiCMOS
+Denotes a lead(Pb)-free/RoHS-compliant package.
*Contact factory for dice specifications.
**Contact factory for availability of SSOP packages
Ordering Information
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND PATTERN
NO.
20 PDIP P20+3 21-0043 —
20SO(W) W20+2 21-0042 90-0108
20SSOP A20+1 21-0056 90-0094
PART TEMP RANGE PIN-PACKAGE
MAX153CAP+ 0°C to +70°C 20SSOP**
MAX153CPP+ 0°C to +70°C 20 PDIP
MAX153CWP+ 0°C to +70°C 20SO(W)
MAX153C/D 0°C to +70°C Dice*
MAX153EAP+ -40°C to +85°C
20SSOP*
*
MAX153EPP+ -40°C to +85°C 20 PDIP
MAX153EWP+ -40°C to +85°C 20WideSO