Datasheet

PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN
32 TQFN-EP T3255+4 21-0140 90-0012
THIN QFN
TOP VIEW
32 31 30 29 28 27 26
DRV1 FBL1 EN AGND VL IN FREQ
25 SEQ
9
10 11 12 13 14 15
FBL5*
DRV5*
RSTIN
RESET
COMP
FB
ILIM
16ONL2
17
18
19
20
21
22
23
ONL3
ONL4*
ONL5*
PGND
DL
LX
DH
8
7
6
5
4
3
2
DRV4*
* = N.C. FOR MAX1530
FBL4*
CSL*
CSH*
DRV3
FBL3
FBL2
MAX1530
MAX1531
1DRV2
24 BST
+
MAX1530/MAX1531 Multiple-Output Power-Supply
Controllers for LCD Monitors
www.maximintegrated.com
Maxim Integrated │ 32
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
PROCESS: BiCMOS
Pin Conguration