Datasheet

2 Maxim Integrated
High-Efficiency, 4A, Step-Down DC-DC
Regulators with Internal Power Switches
MAX15066/MAX15166
ABSOLUTE MAXIMUM RATINGS
Note 1: LX has internal clamp diodes to GND and IN. Applications that forward bias these diodes should take care not to exceed
the device’s package power dissipation.
Note 2:
Package thermal resistances were obtained based on the MAX15066/MAX15166 evaluation kit.
Note 3:
Continuous operation at full current beyond +105NC can degrade product life.
IN to GND
.............................................................. -0.3V to +18V
EN to GND
..................................................-0.3V to (V
IN
+ 0.3V)
LX to GND
............. -0.3V to the lower of +18V and (V
IN
+ 0.3V)
LX to GND (for 50ns)
....-1V to the lower of +18V and (V
IN
+ 0.3V)
PGOOD to GND
......................................................-0.3V to +6V
V
DD
to GND ............. -0.3V to the lower of +6V and (V
IN
+ 0.3V)
COMP, FB, SS to
GND
........................ -0.3V to the lower of +6V and (V
DD
+ 0.3V)
BST to LX
...............................................................-0.3V to +6V
BST to GND
..........................................................-0.3V to +24V
BST to V
DD
........................................................... -0.3V to +18V
LX RMS Current (Note 1)
............................................... 0 to 9A
Converter Output and V
DD
Short-Circuit Duration .......................................... Continuous
Continuous Power Dissipation (T
A
= +70NC)
16-Bump WLP (derate 20.4mW/NC above +70NC)
Multilayer Board
.......................................................1500mW
Thermal Resistance (θ
JA
) (Note 2) ..............................23.6NC/W
Operating Temperature Range
......................... -40NC to +85NC
Junction Temperature (Note 3)
......................................+150NC
Continuous Operating Temperature
at Full Current (Note 3)
................................................+105NC
Storage Temperature Range
.......................... -65NC to +150NC
Soldering Temperature (reflow)
.................................... +260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
IN
= 12V, C
VDD
= 1FF, C
IN
= 22FF, T
A
= T
J
= -40NC to +85NC, typical values are at T
A
= T
J
= +25NC, unless otherwise noted.)
(Note 4)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
STEP-DOWN CONVERTER
Input Voltage Range V
IN
4.5 16 V
Quiescent Current I
IN
Not switching 1.1 2 mA
Shutdown Input Supply Current V
EN
= 0V 2 6
FA
ENABLE INPUT
EN Shutdown Threshold Voltage V
EN_SHDN
V
EN
rising 0.7 V
EN Shutdown Voltage
Hysteresis
V
EN_HYST
70 mV
EN Lockout Threshold Voltage V
EN_LOCK
V
EN
rising 1.7 1.9 2.1 V
EN Lockout Threshold
Hysteresis
V
EN_LOCK_
HYST
200 mV
EN Input Current I
EN
V
EN
= 12V 0.8 2.6 5
FA
POWER-GOOD OUTPUT
PGOOD Threshold V
PGOOD_TH
V
FB
rising 0.54 0.56 0.585 V
PGOOD Threshold Hysteresis
V
PGOOD_
HYST
15 mV
PGOOD Output Low Voltage
V
PGOOD_
OL
I
PGOOD
= 5mA, V
FB
= 0.5V 35 100 mV
PGOOD Leakage Current I
PGOOD
V
PGOOD
= 5V, V
FB
= 0.7V 100 nA
ERROR AMPLIFIER
Error-Amplifier
Transconductance
g
MV
1.6 mS