Datasheet

www.maximintegrated.com
MaximIntegrated │ 2
MAX15062 60V, 300mA, Ultra-Small, High-Efciency,
Synchronous Step-Down DC-DC Converters
Electrical Characteristics
(V
IN
= 24V, V
GND
= 0V, C
IN
= C
VCC
= 1µF, V
EN/UVLO
= 1.5V, LX = MODE = RESET = unconnected; T
A
= T
J
= -40°C to +125°C, unless
otherwise noted. Typical values are at T
A
=+25°C.AllvoltagesarereferencedtoGND,unlessotherwisenoted.)(Note2)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
V
IN
toGND ..............................................................-0.3V to 70V
EN/UVLOtoGND....................................................-0.3V to 70V
LXtoGND .................................................... -0.3V to V
IN
+ 0.3V
V
CC
, FB/V
OUT
, RESETtoGND ...............................-0.3V to 6V
MODEtoGND .............................................-0.3V to V
CC
+ 0.3V
LXtotalRMSCurrent .....................................................±800mA
Output Short-Circuit Duration
.................................... Continuous
Continuous Power Dissipation (T
A
= +70°C)
8-Pin TDFN (derate 6.2mW/NC above +70°C)
...........496mW
OperatingTemperatureRange ......................... -40°C to +125°C
Junction Temperature
...................................................... +150°C
StorageTemperatureRange ............................ -65°C to +150°C
Soldering Temperature (reflow)
....................................... +260°C
Lead Temperature (soldering, 10s)
.................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TDFN
Junction-to-AmbientThermalResistance(θ
JA
) ......+162°C/W
Junction-to-CaseThermalResistance(θ
JC
) .............+20°C/W
Absolute Maximum Ratings
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
INPUT SUPPLY (VIN)
InputVoltageRange V
IN
4.5 60 V
InputShutdownCurrent I
IN-SH
V
EN/UVLO
= 0V, shutdown mode 2.2 4 µA
InputSupplyCurrent
I
Q-PFM
MODE = unconnected,
FB/V
OUT
= 1.03 x FB/V
OUT-REG
95 160 µA
I
Q-PWM
Normal switching mode, V
IN
= 24V 2.5 4 mA
ENABLE/UVLO (EN/UVLO)
EN/UVLO Threshold
V
ENR
V
EN/UVLO
rising 1.19 1.215 1.24
VV
ENF
V
EN/UVLO
falling 1.06 1.09 1.15
V
EN-TRUESD
V
EN/UVLO
falling, true shutdown 0.75
EN/UVLOInputLeakageCurrent I
EN/UVLO
V
EN/UVLO
= 60V, T
A
= +25°C -100 +100 nA
LDO (V
CC
)
V
CC
OutputVoltageRange V
CC
6V < V
IN
<60V,0mA<I
VCC
< 10mA 4.75 5 5.25 V
V
CC
Current Limit I
VCC-MAX
V
CC
= 4.3V, V
IN
= 12V 13 30 50 mA
V
CC
Dropout V
CC-DO
V
IN
=4.5V,I
VCC
= 5mA 0.15 0.3 V
V
CC
UVLO
V
CC-UVR
V
CC
rising 4.05 4.18 4.3
V
V
CC-UVF
V
CC
falling 3.7 3.8 3.95