Datasheet

IN to GND .............................................................. -0.3V to +45V
V
CC
to GND .................... -0.3V to lower of (V
IN
+ 0.6V) and 6V
EN, DRV to GND ..................................................... -0.3V to +6V
PGOOD to GND ....................................................-0.3V to +45V
PGND to GND ......................................................-0.3V to +0.3V
DL to PGND ........................................... -0.3V to (V
DRV
+ 0.3V)
BST to PGND .......................................................-0.3V to +50V
LX and CSP to PGND ..............................................-1V to +45V
LX and CSP to PGND ...........................-2V (50ns max) to +45V
BST to LX ................................................................-0.3V to +6V
CSP to LX ............................................................. -0.3V to +0.3V
DH to LX ..................................................-0.3V to (V
BST
+ 0.3V)
All Other Pins to GND .............................. -0.3V to (V
CC
+ 0.3V)
V
CC
Short Circuit to GND .........................................Continuous
PGOOD Maximum Sink Current ........................................20mA
Continuous Power Dissipation (T
A
= +70°C):
16-Pin QSOP (derate 9.6mW/°C above +70°C) .......771.5mW
16-Pin QSOP-EP
(derate 22.7mW/°C above +70°C) .........................1818.2mW
Operating Temperature Range ......................... -40°C to +125°C
Junction Temperature ...................................................... +150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) ....................................... +260°C
QSOP
Junction-to-Ambient Thermal Resistance (θ
JA
) .....+103.7°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ...............+37°C/W
QSOP-EP
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........+44°C/W
Junction-to-Case Thermal Resistance (θ
JC
) .................+6°C/W
(Note 1)
(V
IN
= 24V, V
EN
= 5V, V
GND
= V
PGND
= 0V, C
IN
= 1µF, C
VCC
= 4.7µF, R
RT
= 49.9kΩ, T
A
= T
J
= -40°C to +125°C, unless otherwise
noted. Typical values are at T
A
= +25°C.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SYSTEM SPECIFICATIONS
Input-Voltage Range V
IN
4.5 40
V
V
IN
= V
CC
= V
DRV
4.5 5.5
Quiescent Supply Current I
IN_Q
V
IN
= 24V, V
FB
= 0.9V, no switching 2 3 mA
Shutdown Supply Current I
IN_SBY
V
IN
= 24V, V
EN
= 0V, I
VCC
= 0, PGOOD
= unconnected
0.35 0.55 mA
V
CC
REGULATOR
Output Voltage V
CC
6V ≤ V
IN
≤ 40V, I
LOAD
= 6mA 5 5.25 5.5 V
V
CC
Regulator Dropout V
IN
= 4.5V, I
LOAD
= 25mA 0.18 0.45 V
V
CC
Short-Circuit Output Current V
IN
= 5V 30 55 90 mA
V
CC
Undervoltage Lockout V
CCUVLO
V
CC
rising 3.8 4 4.2 V
V
CC
Undervoltage Lockout
Hysteresis
400 mV
ERROR AMPLIFIER (FB, COMP)
FB Input-Voltage Set Point V
FB
584 590 596 mV
FB Input Bias Current I
FB
V
FB
= 0.6V -250 +250 nA
FB to COMP Transconductance g
M
I
COMP
= ±20µA 600 1200 1800 µS
Open-Loop Gain 80 dB
Unity-Gain Bandwidth Capacitor from COMP to GND = 47pF 5 MHz
MAX15046 40V, High-Performance, Synchronous
Buck Controller
www.maximintegrated.com
Maxim Integrated │ 2
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
Electrical Characteristics