Datasheet
V
DDA
to GNDA, V
DDB
to GNDB .............................-0.3V to +6V
INA_, ENA to GNDA ................................................-0.3V to +6V
INB_, ENB to GNDB ...............................................-0.3V to +6V
OUTA_ to GNDA .................................... -0.3V to (V
DDA
+ 0.3V)
OUTB_ to GNDB .................................... -0.3V to (V
DDB
+ 0.3V)
Short-Circuit Duration
(OUTA_ to GNDA, OUTB_ to GNDB) ..................Continuous
Continuous Power Dissipation (T
A
= +70°C)
Wide SOIC (derate 14.1mW/°C above +70°C) ...... 1126.8mW
Operating Temperature Range ......................... -40°C to +125°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) ...................................... +260°C
Wide SOIC
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........71°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ...............23°C/W
(Note 1)
(V
DDA
- V
GNDA
= +1.71V to +5.5V, V
DDB
- V
GNDB
= +1.71V to +5.5V, C
L
= 15pF, T
A
= -40°C to +125°C, unless otherwise noted.
Typical values are at V
DDA
- V
GNDA
= +3.3V, V
DDB
- V
GNDB
= +3.3V, V
GNDA
= V
GNDB
, T
A
= +25°C, unless otherwise noted.) (Note 2)
MAX14934–MAX14936 Four-Channel, 5kV
RMS
Digital Isolators
www.maximintegrated.com
Maxim Integrated
│
2
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
Operating Supply Voltage
V
DDA
Relative to GNDA 1.71 5.5 V
V
DDB
Relative to GNDB 1.71 5.5 V
Undervoltage Lockout Threshold V
UVLO
_ V
DD
_ rising 1.45 1.58 1.71 V
Undervoltage Lockout Threshold
Hysteresis
V
UVLO
_
HYST
50 mV
DC Electrical Characteristics
Absolute Maximum Ratings
Package Thermal Characteristics
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.