Datasheet

8 Maxim Integrated
Quad Serial UART with 128-Word FIFOs
MAX14830
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to AGND.)
V
L
, V
A
, V
EXT
, XIN ................................................ -0.3V to +4.0V
V
18
, XOUT ........... -0.3V to the lesser of (V
A
+ 0.3V) and +2.0V
RST, IRQ, MOSI/A1, CS/A0, SCLK/SCL,
MISO/SDA, LDOEN, SPI/
I2C .................. -0.3V to (V
L
+ 0.3V)
TX0, RX0, CTS0, GPIO0, GPIO1,
GPIO2, GPIO3
..................................... -0.3V to (V
EXT
+ 0.3V)
TX1, RX1, CTS1, GPIO4, GPIO5,
GPIO6, GPIO7
..................................... -0.3V to (V
EXT
+ 0.3V)
TX2, RX2, CTS2, GPIO8, GPIO9,
GPIO10, GPIO11
................................. -0.3V to (V
EXT
+ 0.3V)
TX3, RX3, CTS3, GPIO12, GPIO13,
GPIO14, GPIO15
................................. -0.3V to (V
EXT
+ 0.3V)
DGND
.................................................................. -0.3V to +0.3V
Continuous Power Dissipation (T
A
= +70NC)
TQFN (derate 38.5mW/NC above +70NC).....3076.9mW
Operating Temperature Range
........................ -40NC to +85NC
Maximum Junction Temperature
................................. +150NC
Storage Temperature Range
......................... -65NC to +150NC
Lead Temperature (soldering, 10s)
..................................300NC
Soldering Temperature (reflow)
.....................................+260NC
DC ELECTRICAL CHARACTERISTICS
(V
A
= +2.35V to +3.6V, V
L
= +1.71V to +3.6V, V
EXT
= +1.71V to +3.6V, T
A
= -40NC to +85NC, unless otherwise noted. Typical values
are at V
A
= +2.5V, V
L
= +1.8V, V
EXT
= +2.8V, T
A
= +25NC.) (Notes 2, 3)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) ........... 26NC/W
Junction-to-Case Thermal Resistance (B
JC
) ..................1NC/W
(Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Digital Interface Supply Voltage V
L
1.71 3.6 V
Analog Supply Voltage V
A
2.35 3.6 V
UART Interface Logic Supply
Voltage
V
EXT
1.71 3.6 V
Logic Supply Voltage V
18
1.65 1.95 V
CURRENT CONSUMPTION
V
A
Supply Current I
A
1.8MHz crystal oscillator active, PLL
disabled, SPI/I
2
C interface idle, UART
interfaces idle, V
LDOEN
= V
L
400
FA
Baud rate = 1Mbps, 20MHz external clock,
SPI/I
2
C interface idle, PLL disabled, all
UARTs in loopback mode, V
LDOEN
= 0V
0.5 mA
V
A
Shutdown Supply Current I
ASHDN
Shutdown mode, V
LDOEN
= 0V, V
RST
= 0V,
all inputs and outputs are idle
35
FA
V
L
Shutdown or Sleep Supply
Current
I
L
Shutdown mode, V
LDOEN
= 0V, V
RST
= 0V,
all inputs and outputs are idle
12
FA
V
EXT
Shutdown Supply Current I
EXT
Shutdown mode, V
LDOEN
= 0V, V
RST
= 0V,
all inputs and outputs are idle
8
FA