Datasheet

V
DD
to V
SS
............................................................ -0.3V to +72V
V
SS
to GND ........................................................... -36V to +0.3V
V
L
, EN_ to GND ........ -0.3V to the lesser of (+12V, V
DD
+ 0.3V)
A_, B_ to V
SS
.............................. -0.3V to (V
DD
+ 2V) or 100mA
(whichever occurs first)
Continuous Current into A_, B_......................................±100mA
Continuous Power Dissipation (T
A
= +70°C)
TSSOP (derate 11.1mW/°C above +70°C) .................889mW
Operating Temperature Range ........................... -40°C to +85°C
Storage Temperature Range ............................ -65°C to +150°C
Junction Temperature ...................................................... +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) ....................................... +260°C
TSSOP
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........90°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ...............27°C/W
(Note 1)
(V
DD
= +35V, V
SS
= -35V, V
GND
= 0V, V
L
= +3.3V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at T
A
= +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
V
DD
Supply-Voltage Range V
DD
+10 +35 V
V
SS
Supply-Voltage Range V
SS
-10 -35 V
V
L
Logic Supply-Voltage Range V
L
+1.6 +11 V
V
DD
Supply Current
I
DD(OFF)
V
EN_
to switch off state, V
A_
, V
B_
= +20V 200 450
µA
I
DD(ON)
V
EN_
to switch on state, V
A_
, V
B_
= +20V 500 800
V
SS
Supply Current
I
SS(OFF)
V
EN_
to switch off state, V
A_
, V
B_
= +20V 200 450
µA
I
SS(ON)
V
EN_
to switch on state, V
A_
, V
B_
= +20V 500 800
V
L
Current I
L
V
L
= +11V, V
EN1
= V
EN2
= V
EN3
= V
EN4
=
(0.25 x V
L
) or ( 0.75 x V
L
)
0.4 mA
SWITCH
Analog-Signal Range V
A_,
V
B_
Figure 1 V
SS
V
DD
V
Current Through Switch I
A_,
I
B_
V
A_
, V
B_
= +20V -50 +50 mA
On-Resistance R
ON
I
A_
, I
B_
= 10mA, V
A_
, V
B_
= ±20V, Figure 1 5 10 Ω
On-Resistance Matching
Between Channels
∆R
ON
I
A_
, I
B_
= 10mA, V
A_
, V
B_
= ±20V, 0V
(Note 2)
0.3 0.5 Ω
On-Resistance Flatness R
FLAT(ON)
I
A_
, I
B_
= 10mA, V
A_
, V
B_
= ±20V 0.004 Ω
On-Leakage Current I
A/B_(ON)
V
B_
= ±20V, V
A_
= unconnected, Figure 2 -5 +5
nA
V
B_
= ±20V, V
A_
= unconnected,
T
A
= +25°C, Figure 2
0.01
Off-Leakage Current I
A/B_(OFF)
V
B_
= ±20V, V
A_
= -20V, Figure 3 -2.5 +2.5
nA
V
B_
= ±20V, V
A_
= -20V, T
A
= +25°C,
Figure 3
0.01
MAX14756/MAX14757/
MAX14758
Quad SPST +70V Analog Switches
www.maximintegrated.com
Maxim Integrated │ 2
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
Electrical Characteristics—Dual Supplies