Datasheet
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
16 SSOP A16+2 21-0056 90-0106
16 TSSOP U16+2 21-0066 90-0117
24 TQFN-EP T2444+4 21-0139 90-0022
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
ISRC FSOTC
AMP+
AMP-
AMPOUT
CLK1M
DIO
UNLOCK
V
DDF
TOP VIEW
MAX1452
SSOP/TSSOP
OUT
V
SS
INP
INM
BDR
V
DD
TEST
2324 22 21
87 9
N.C.
TEST
V
DDF
UNLOCK
10
V
DD
N.C.
FSOTC
N.C.
N.C.
AMP+
1
2
+
+
INM
4
5
6
17
18
16
14
13
BDR
INP
N.C.
CLK1M
DIO
N.C.
MAX1452
N.C.
N.C.
3
15
V
SS
20
11
AMPOUT
OUT
19
12
AMP-
ISRC
TQFN
MAX1452 Low-Cost Precision Sensor
Signal Conditioner
www.maximintegrated.com
Maxim Integrated
│
24
Pin Congurations
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
SUBSTRATE CONNECTED TO: V
SS