Datasheet

RS-485 Transceivers with Integrated
100 Ω /120 Ω Termination Resistors
MAX13450E/MAX13451E
2 ______________________________________________________________________________________
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
V
CC
, V
L
...................................................................-0.3V to +6V
DE, RE, DI, RO, TERM, TERM100, SRL ..... -0.3V to (V
L
+ 0.3V)
INV, FAULT ................................................. -0.3V to (V
L
+ 0.3V)
A, B, Z, Y ..................................................................-8V to +13V
A to B (High-Z State) ......................................................... +14V
B to A (High-Z State) ......................................................... +14V
Short-Circuit Duration (RO, Y, Z) to GND ................ Continuous
Continuous Power Dissipation (T
A
= +70NC)
TSSOP (derate 25.6mW/NC above +70NC)................2051mW
Operating Temperature Range ....................... -40NC to +125NC
Storage Temperature Range .......................... -65NC to +150NC
Junction Temperature ....................................................+150NC
Lead Temperature (soldering, 10s) ...............................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(V
CC
= +4.5V to +5.5V, V
L
= +1.62V to V
CC
, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
CC
= +5V,
V
L
= +1.8V, and T
A
= +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (q
JA
) ..........39°C/W
Junction-to-Case Thermal Resistance (q
JC
) .................3°C/W
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
CC
4.5 5.5 V
Logic Supply Voltage V
L
1.62 1.8 V
CC
V
Supply Current I
CC
DE = RE = high, TERM = high, no load
6
mA
DE = RE = low, TERM = low, no load
12
Logic Supply Current I
L
Current into V
L
, no load on RO, device not
switching, DE = RE = high
2
FA
Shutdown Current I
SHDN
Current into V
CC
, DE = low, RE = TERM =
high
30
FA
Current into V
CC
, DE = low, RE = high,
TERM = low
8 mA
DRIVER
Differential Driver Output V
OD
R
DIFF
= 100I, Figure 1 (Note 3)
2.0 V
CC
V
R
DIFF
= 46I, Figure 1 (Note 3)
1.5 V
CC
Change in Magnitude of
Differential Output Voltage
DV
OD
R
DIFF
= 100I or 46I, Figure 1 (Note 3)
0.2 V
Driver Common-Mode Output
Voltage
V
OC
R
DIFF
= 100I or 46I, Figure 1 (Note 3)
V
CC
/2 3 V
Change In Magnitude of
Common-Mode Voltage
DV
OC
R
DIFF
= 100I or 46I, Figure 1 (Note 3)
0.2 V
Driver Short-Circuit Output
Current
I
OSD
0V P V
OUT
P +12V
+280
mA
-7V P V
OUT
P 0V
-250