Datasheet
may not be necessary. In these cases, the drive current
can be reduced to minimize the die temperature.
Minimizing the load on the V
REG
output lowers the
power dissipation of the part and ultimately reduces the
maximum die temperature.
θθ
CA
θ
CA
is the thermal resistance from case to ambient and
is independent of the MAX13410E–MAX13415E.
θ
CA
is
primarily a characteristic of the circuit-board design. The
largest contributing factor of
θ
CA
will be the size and
weight of the copper connected to the exposed paddle
of the MAX13410E–MAX13415E. Lower the thermal
resistance by using as large a pad as possible.
Additionally, vias can be used to connect the pad to
other ground planes in the circuit board.
Note that
θ
JC
is the thermal resistance of the part from
junction-to-case temperature and is fixed at 6.0°C/W. It is
solely based on the die and package characteristics of
MAX13410E–MAX13415E
RS-485 Transceiver with Integrated Low-Dropout
Regulator and AutoDirection Control
______________________________________________________________________________________ 17
Functional Diagrams
Functional Diagram for the MAX13410E/MAX13411E/MAX13414E/MAX13415E
A
GNDDI
1
2
8
7
V
CC
BRE
DE
RO
3
4
6
5
R
D
+
LDO
MAX13410E
MAX13411E
A
GNDDI
1
2
8
7
V
CC
BDE/RE
V
REG
RO
3
4
6
5
R
D
+
LDO
MAX13414E
MAX13415E
Functional Diagram for the MAX13412E/MAX13413E
V
CC
8
-
+
+
-
STATE
MACHINE
D
R
A
B
RE
DI
RO
COM
V
REG
RE
GND
V
REG
1
3
2
4
6
7
5
RI
DI
V
DT
MAX13412E
MAX13413E
V
REG
LDO
V
REG
DE