Datasheet

PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
20 TSSOP U20+2
21-0066
90-0116
24 TSSOP U24+1 90-0118
MAX1300
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
AGND1
ANALOG
INPUT MUX
AND
MULTIRANGE
CIRCUITRY
PGA
AGND2
AV
DD2
4.096V
BANDGAP
REFERENCE
1x
5kΩ
IN
REF
REFCAP
REF
CONTROL LOGIC AND REGISTERS
FIFO
CLOCK
OUT
SAR
ADC
SERIAL I/O
AGND2
AVDD2
AGND3
AVDD1
DGND
DVDD
DGNDO
SCLK
DOUT
SSTRB
DIN
CS
DVDDO
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
AGND2
AVDD2
AGND3
REFCH1
CH0
AVDD1
AGND1
REFCAP
DVDD
DVDDO
DGNDDIN
CS
CH3
CH2
12
11
9
10
DGNDO
DOUTSCLK
SSTRB
MAX1301
TSSOP
TOP VIEW
MAX1300/MAX1301 8- and 4-Channel, ±3 x V
REF
Multirange Inputs,
Serial 16-Bit ADCs
www.maximintegrated.com
Maxim Integrated │ 30
Block Diagram
Pin Congurations (continued)
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
PROCESS: BiCMOS