Datasheet

PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
16 QSOP E16+5 21-0055 90-0167
24 QSOP E24+1 21-0055 90-0172
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
EOC
DOUT
DIN
CS
AIN3
AIN2
AIN1
AIN0
TOP VIEW
SCLK
V
DD
GND
REFAIN7
AIN6
AIN5
AIN4
16
15
14
13
9
10
11
12
AIN14
CNVST/AIN15
AIN13
AIN12AIN11
AIN10
AIN9
AIN8
QSOP
MAX11632
MAX11633
+
MAX11626–MAX11629/
MAX11632/MAX11633
12-Bit, 300ksps ADCs
with FIFO and Internal Reference
www.maximintegrated.com
Maxim Integrated │ 21
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
PROCESS: BiCMOS
Pin Congurations